Optical Via for Silicon Photonic 3D-Integrations

Tianhua Lin,Qin Han,Tao Chu
DOI: https://doi.org/10.1016/j.optcom.2019.07.031
IF: 2.4
2019-01-01
Optics Communications
Abstract:We proposed an optical via through which both O- and C-band lights can be coupled from a fiber into different waveguide layers of a silicon photonic chip with multiple waveguide layers. The optical via consists of two grating couplers with various structures in different waveguide layers; these couplers are optimized through particle swarm optimization. From a single fiber, coupling efficiencies of −6.01 and −4.15 dB at 1300 and 1536 nm, respectively, were experimentally obtained for the two grating couplers.
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