Influence of titanium coating on the microstructure and thermal behavior of Dia./Cu composites

Chun Zhang,Richu Wang,Chaoqun Peng,Yougen Tang,Zhiyong Cai
DOI: https://doi.org/10.1016/j.diamond.2019.107449
IF: 3.806
2019-01-01
Diamond and Related Materials
Abstract:Copper matrix composites reinforced with various Ti-coated diamond (Dia.) particles were fabricated by hot pressing, and the microstructures and thermal behavior were investigated through the experiments, finite element method (FEM), and theoretical calculation. The results show that a thinner and more complete titanium coating with the formation of interfacial strengthening phase TiC favors the elimination of pores and gaps at the interface. The titanium coating and its integrity/thickness are crucial to improve the interfacial bonding between the diamond and matrix and the thermal conductivity of the composite. The thermal stress and thermal strain simulated by FEM suggest that the titanium coating becomes a buffer layer to sustain the interfacial bonding. Additionally, the effective thermal conductivity was analyzed based on the DEM model and compared with the FEM results. The FEM analysis provides a better understanding of the heat transfer in the composites.
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