Abstract:This paper discusses a nanometer level precision alignment technique as applied to highly efficient micro optics packaging using heat curable adhesives. To achieve a fast curing process, we deposit microwave energy to the spot where optical bonding is desired. Conventional microwave heating technique, however, as we know it, relies on large mass ratio between the epoxy and the components to be bonded. In order to improve the efficiency of heat absorption by the tiny amount of adhesive used for micro optics packaging, we pre-process the components to be bonded, by first polishing the bonding surfaces and then depositing a very thin layer of metalized film on them. An infrared (IR) remote temperature sensor is utilized to monitor the temperature of the adhesive (to prevent over heating). An automated system can then adjust the power output of the microwave so that a fairly constant curing temperature can be maintained. During the fast curing process, pre-alignment of micro optics, such as fiber optic coupler, will inevitably suffer minor misalignment due to non-uniform heating of the components. To compensate for this side-effect, we have developed a real time alignment monitoring and feedback controlled system. As an example to packaging fiber couplers, such a system can monitor the insertion loss (IL) of a component in real time while the adhesive is being cured by the microwave energy. A 3-dimensional piezo-electric transducer (PZT) is employed to achieve the x-, y-, and z-axis alignment. A level of 10 nanometer alignment can be readily achieved which in turn leads to an IL sensitivity of as small as 0.004dB. An improvement of a packaging efficiency as high as 150 times has been demonstrated, compared to conventional blind oven curing process. Yield of micro optics packaging is also expected to increase due to the use of real time alignment process.

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