A High-Sensitivity Resonant Tangential E-Probe With Loaded Improved Dipole and Embedded Integrated Balun

Jianwei Wang,Zhaowen Yan,Wei Liu,Donglin Su,Xin Yan,Jun Fan
DOI: https://doi.org/10.1109/TIM.2019.2920700
IF: 5.6
2019-01-01
IEEE Transactions on Instrumentation and Measurement
Abstract:In this paper, a high-sensitivity resonant probe for capturing tangential <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$E$ </tex-math></inline-formula> -field component is fabricated on a four-layer printed circuit board. The resonant probe consists of an improved dipole employed to further enhance sensitivity, a resonator made up of open- and short-circuit stubs achieving specific resonance, and an integrated Marchand balun used to transform the differential-mode voltage to the single-end output and match the instrument port impedance match. Compared with the referenced broadband probe, the relative sensitivity of the proposed resonant probe in terms of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\vert S_{12}\vert $ </tex-math></inline-formula> is enhanced by 13.21 and 14.82 dB for simulation and measurement, respectively. The absolute sensitivity in terms of the noise-equivalent field strength (NEFS) is 26.4 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${\mathrm{ dB}} \mu {\mathrm{ V}} ({\mathrm{ Hz}})^{1/2} $ </tex-math></inline-formula> . The measurements of the passive circuits (microstrip lines and coupled lines) and active circuit module are conducted to validate the resonant probe.
What problem does this paper attempt to address?