Abstract:Microvia interconnection technology, which mainly includes blind via and buried via, has been put forward to meet the trends of ldquofaster, lighter, reliablerdquo in electronic industry. The technology plays a crucial role in the development of low cost and high density printed circuit board (PCB). However, as the cost for raw materials, like copper, keeps increasing, one defect blind via will lead to not only failure of the whole board but great economic loss as well. The defect causes and mechanisms have been diversified due to the complexity of process, which can be traced back to material property, microvia design, manufacturing process and service environment etc.. This paper focuses on systematic failure analysis of blind vias on PCB for novel mobile phones. A series of modern analytical instruments and methods were used to observe defects of the vias. Meanwhile, focused ion beam (FIB) was adopted, for the first time, both at home and abroad, to obtain the microstructure of copper grains in the cracking interface. Characterization techniques such as FT-IR, TGA and SAM were also performed to inspect thermal stability of the bare boards. The results have shown that obvious cracking occurring along the interface of different plating layers is the main cause of open circuit; and that both sulfur impurity on wall of the vias related to incomplete desmear process and inappropriate location of the vias concerned with circuit design predominantly account for blind vias cracking. It has been revealed that the reason of the cracking generation is concerned with the sulfur segregation and the formation of brittle CuxS (1lesxles2). Moreover, the influence of warpage on the reliability of the via has also been mentioned. Based on these defaults, improvement countermeasures and suggestions have been addressed in the paper, which are of significant value for reference to the safe reliability and structural integrity of PCB products during manufacturing and servic- - es.

Failure Analysis on Cracking of Blind and Buried Vias of Printed Circuit Board for High-End Mobile Phones

Failure Analysis on Blind Vias of PCB for Novel Mobile Phones

Root Causes Analysis on Malfunction of PCBA in Smartphone

Analysis on cracking blind vias of PCB for mobile phones

Failure investigation on copper-plated blind vias in PCB

Failure Analysis of BGA Solder Joint in PCB for Novel Mobile Phones

Investigation on PCB Related Failures in High-Density Electronic Assemblies

Feasibility Study of the Application of Voltage Contrast to Printed Circuit Board

A Method Of Printed Circuit Board Failure Diagnosis Based On Infrared Image Processing

Pcb Related Failures in Electronic Assemblies

Failure Analysis of Printed Circuit Board

Failure Prevention on Application of Flexible Printed Circuits

Failure analysis on the BGA solder joint

Printed-Circuit Board Model Establishment and Solder Joint Failure Analysis

Failure analysis on the premature delamination in the power module of the inverter for new energy vehicles

Failure Analysis on Electrolytic Ni/Au Surface Finish of Pcb Used for Wire Bonding and Soldering

Investigation of Thin Small Outline Package (TSOP) Solder Joint Crack after Accelerated Thermal Cycling Testing

Review of vision-based defect detection research and its perspectives for printed circuit board

Failure Analysis of Halide of Epoxy Molding Compound Used for Electronic Packing

Research on the process of Micro buried/blind Via in HDI rigid-flex PCB

Failure Mechanism of Solder Bubbles in PCB Vias During High‐temperature Assembly