Modified Electromechanical Impedance-Based Disbond Monitoring for Honeycomb Sandwich Composite Structure

Jianjian Zhu,Yishou Wang,Xinlin Qing
DOI: https://doi.org/10.1016/j.compstruct.2019.03.033
IF: 6.3
2019-01-01
Composite Structures
Abstract:The increasing use of honeycomb sandwich composites in industries has attracted much interest in its structural health monitoring (SHM) for the localization and quantification of disbond on skin-core interface. The disbond monitoring in sandwich composites is more complicated than that in laminates. In this paper, a comprehensive active monitoring scheme (CAMS) and direct coupling mechanical impedance (DCMI) signatures extraction approach are proposed. It is developed from a modified electromechanical impedance (EMI) analytical model to extract more useful signatures from measured raw signatures (RS). A damage index (DI), root mean square deviation (RMSD), is adopted to locate and quantify the disbond extent inside structures. Experiments are conducted on a honeycomb sandwich composite with a 4 x 4 sensors array mounted on top skin to validate the effectiveness of proposed monitoring scheme. The experimental results show that both disbond location and severity on skin-core interface can be monitored efficaciously.
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