The Effects Of Curvature On The Thermal Conduction Of Bent Silicon Nanowire

Xiangjun Liu,Hangbo Zhou,Gang Zhang,Yong-Wei Zhang
DOI: https://doi.org/10.1063/1.5054323
IF: 2.877
2019-01-01
Journal of Applied Physics
Abstract:Curvature induced by mechanical deformation in nanostructures has been found to significantly affect their stability and reliability during applications. In this work, we investigated the effects of curvature induced by mechanical bending on the thermal properties of silicon nanowire (SiNW) by using molecular dynamics simulations. By examining the relationship between the curved geometry and local temperature/heat flux distribution, we found that there is no temperature gradient/heat flux along the radial direction of the bent SiNW, and the local heat current density along the circumferential direction varies with the radius of curvature. Interestingly, a similar to 10% reduction in the thermal conductivity is found in the bent SiNW due to the depression of long-wavelength phonons caused by its inhomogeneous deformation. The present work demonstrates that the curvature induced by mechanical bending can be used to modulate the thermal conductivity of SiNWs. Published by AIP Publishing.
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