Strain Field Measurements over 3000 °C Using 3D-Digital Image Correlation
Zhiwei Pan,Shenghong Huang,Yong Su,Meixia Qiao,Qingchuan Zhang
DOI: https://doi.org/10.1016/j.optlaseng.2019.105942
IF: 5.666
2019-01-01
Optics and Lasers in Engineering
Abstract:With the development of aerospace and fusion engineering, understanding the mechanical behavior of materials under high-temperature conditions has become increasingly important. However, few studies are devoted to the ultra-high temperature range of 2000-3000 degrees C. In this study, with the aim of developing non-contact measuring techniques of mechanical deformation under ultra-high temperature, a high heat flux (similar to 300 MW) comprehensive experimental platform is established, which includes a vacuum chamber, a three-dimensional digital image correlation (3D-DIC) system, infrared radiation thermometers and an electron beam heating system. Using the electron beam heating technique, the tungsten specimen can be heated to over 3000 degrees C. Owing to the use of a vacuum chamber, the thermally induced airflow disturbance at high temperature can be completely removed. Tantalum carbide (TaC) powder is chosen as the speckle material and speckle fabrication technology is developed to adapt ultra-high temperatures under vacuum conditions. In order to suppress the blackbody radiation at high temperature, three schemes based on blue light sources, self-radiating light sources and a dual wavelength optical filter technique are designed for three temperature ranges from room temperature to 3067 degrees C. Afterwards, full-field thermal deformation of the tungsten specimen above 3000 degrees C was determined based on the above strategies using the 3D-DIC technique. The feasibility and accuracy of the proposed methods are verified by comparing the measurement results with the thermal expansion strain data and model from available databases and literature. The standard deviations in different temperature intervals are 50 mu epsilon for 25-1200 degrees C, 100-200 mu epsilon for 1200-1800 degrees C and less than 500 mu epsilon for 1800-3067 degrees C. The proposed methods and technologies are expected to lay a foundation for further developments in strain field measurements at ultra-high temperature.