An Analytical Model on Through-Thickness Stresses and Warpage of Composite Laminates Due to Tool–part Interaction

Zhenyi Yuan,Yongjun Wang,Xiongqi Peng,Junbiao Wang,Shengmin Wei
DOI: https://doi.org/10.1016/j.compositesb.2016.01.016
IF: 11.322
2016-01-01
Composites Part B Engineering
Abstract:Tool–part interactions play an important role in the deformation of composite components during forming, especially for thin laminates. In this paper, taking into account the effect of slipping between the tool and composite laminates, an analytical model is proposed to predict the through-thickness residual stresses and warpage of a composite part during the curing process without extensive resin characterization. A parametric study examining the effects of various interfacial shear stresses on warpage is performed and the results are compared with experimental data in the literature. Good agreements are obtained. The results show that warpage is enhanced linearly with the increase of interfacial shear stress and the stress distribution does not take on an exponential form for [90/0]s lay-up. It is also shown that this model could successfully predict part processing deformations without extensive resin characterization.
What problem does this paper attempt to address?