Reliability Modeling and Testing Techniques for RF/microwave Power Amplifiers

Qian-Fu Cheng,Hai-Peng Fu,Jian-Guo Ma
DOI: https://doi.org/10.1109/nemo.2016.7561653
2016-01-01
Abstract:The reliability of RF/microwave power amplifiers (PAs) is key issue for the transceivers, since the PA is one of the most critical building blocks in RF front-ends of the wireless/mobile communication systems. To effectively evaluate the reliability of the RF/microwave PAs, it is essential to conduct specific reliability test, especially for the temperature, since temperature is considered to be the main influence on reliability of the PA. Moreover, in order to analyze and predict the PA reliability, fast reliability modeling is necessary and useful. This paper reports a temperature reliability testing technique and a fast and high-accuracy PA reliability modeling technique with the automated model generation (AMG) algorithm to investigate and analyze the RF/microwave PA reliability comprehensively.
What problem does this paper attempt to address?