Abstract:Abstract In this paper, we propose a thermal wind speed sensor Verilog-A model with thermal-fluid-electric hybrid characteristics. Because the structure of the thermal wind sensor and the interface circuit chip are designed separately, which cannot effectively carry out MEMS-IC (integrated circuit) co-simulation, the overall performance of the sensor and interface circuit chip is prone to large deviation. At the same time, the separation of MEMS structure and IC design process leads to long product development cycle and high cost. This paper proposes an improved simulation model by analyzing the behavior characteristics of the thermal wind speed sensor. The simulation model consists of 11 thermistors, 3 capacitors, a voltage-controlled voltage source, and a voltage-controlled current source. The Taylor series expansion of the differential equation of heat conduction is carried out, and then the thermistor and capacitor networks are established according to the corresponding relationship between the thermal parameters and the electrical parameters, including the thermal conduction unit, the convection unit and the heat capacity in the chip. The model fully considers the effects of various physical effects and parasitic effects, and is implemented using the hardware description language Verilog-A. The sensor and interface circuit can be simulated simultaneously to optimize the circuit design. It is beneficial to the integration of sensors and interface circuit, reducing the number of tape-outs, increasing the success rate, and reducing costs. The consistency between the simulation results and the experimental curves verified the correctness of the macro model. The behavior characteristics of constant power (CP) and constant temperature heating were described. In CP mode, the output voltage error is less than ± 6.5%, the chip temperature error is less than 4.0%. The presented modeling approach can be the basis for the development of complete MEMS-IC design technology library of thermal wind speed sensor, aiming at optimum designs of integrated thermal wind speed sensor.

The Terminal Behaviors Modeling Method for Complex Microsystems

Research on Terminal Behavior of Electrostatic Micropump

Research On Terminal Behavior Of Electrostatically Actuated Micropump Membrane Based On Modal Analysis - Art. No. 60400u

Flexible Design Modeling Methodology for MEMS Based on Petri Net

Modeling and Evaluation of Common-Mode EMI Coupling Through Converter Chassis in Metro Traction System

Macro modeling method for electrostatic-drive silicon diaphragm

Electromagnetic-Circuital-Thermal Co-Simulation for Integrated Circuits and Microwave Applications

HI-13 Tandem Accelerator Terminal Voltage Modeling Research and Hardware Simulation Platform Design

A Thermal Network Model for Multichip Power Modules Enabling to Characterize the Thermal Coupling Effects

Monte Carlo Simulation and Macro-Model of Single-Electron Transistor

Modeling, Simulation and Automatic Verification of Hybrid Systems under Matlab Environment

System-level model integration of design and simulation for mechatronic systems based on SysML

Modeling and Simulation for Multi Energy Flow Coupled Network Computing

Integration Of System-Level Design And Analysis Models Of Mechatronic System Behavior Based On Sysml And Simscape

Impedance-Based AC/DC Terminal Modeling and Analysis of the MMC-BTB System

Impedance-based AC/DC Terminal Modeling and Analysis of MMC-BTB system

A multiphysics SET modeling method based on machine learning

SysML-based Uniform Behavior Modeling and Automated Mapping of Design and Simulation Model for Complex Mechatronics

An efficient macro model for CMOS-MEMS thermal wind speed sensor

Compact modeling beyond device physics

A Unified Electrothermal Behavior Modeling Method for Both SiC MOSFET and GaN HEMT