Research Progress of Nano-ECAs for Electronic Packaging

ZHOU Liang-jie,HUANG Yang,WU Feng-shun,XIA Wei-sheng,FU Hong-zhi,WANG Shi-yu,LIU Zhe
DOI: https://doi.org/10.14176/j.issn.1001-3474.2013.01.001
2013-01-01
Abstract:Nano-conductive adhesives have been attracting more and more interest in microelectronic packaging field due to their unique electrical and mechanical properties compared to conventional conductive adhesives.There has been extensive research on electrical conductive adhesives with nanotechnologies,such as introducing nano-particles,nano-wires,carbon nanotubes or graphene into conductive fillers and introducing self-assembled molecular wires(SAM) into the interface between metal fillers and metal-finished bond pad of ACAs.provide a comprehensive review of most recent advances in nano-conductive adhesives.
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