Abstract:Owing to the physical restriction of the buildings and willingness of seeking a higher temperature difference, the hot and cold sides of a thermoelectric module often require a separation treatment, whilst the soft wire or wireless connections between the hot and cold sides can be implemented. This paper investigated a novel separated micro-thermoelectric cooler (micro-TEC) configuration for cooling, which splits the hot and cold sides of the micro-TECs for a distance, with the copper connecting wire in between. A dedicated mathematic numerical simulation for the micro-TEC was carried out. The results show that for a traditional micro-TEC, the maximum coefficient of power (COP) of the micro-TEC is 1.1923 which occurs at the current of 50 mA and temperature difference of 20 K. For the novel separated micro-TEC with connecting wires, the maximum COPs at the wire lengths of 25 μm, 50 μm, 100 μm, 200 μm are 0.9258, 0.9226, 0.9162 and 0.9035 respectively, during which current of 50 mA and temperature difference of 20 K are applied. Although the maximum COP of the micro-TEC is reduced by about 0.2, the distance between the cold and hot sides has a significant increase. Under the condition of current of 50 mA and temperature difference of 20 K, the cooling capacity of the micro-TEC with connecting wire length of 0 μm, 25 μm, 50 μm, 100 μm and 200 μm are 0.0023943 W, 0.0021351 W, 0.0021292 W, 0.0021173 W and 0.0020937 W respectively. Thus, the reduction of the cooling capacity caused by connecting wire is less than that of the COP loss. Further, the maximum COPs of the micro-TEC under the wire length ratio of 4:1, 3:2, 1:1, 2:3 and 1:4 are 0.87924, 0.8953, 0.9035, 0.91186 and 0.92922, during which current is 50 mA and temperature difference is 20 K. The cooling capacity of the micro-TEC under the length ratio of 4:1, 3:2, 1:1, 2:3 and 1:4 are 0.0020319 W, 0.0020729 W, 0.0020937 W, 0.0021148 W and 0.0021577 W respectively, during which the current of 50 mA and temperature difference of 20 K are implemented.

Research on the Power Supply for Thermoelectric Cooler

Performance analysis of a micro-scale pulse tube cryocooler based on optical fiber regenerator

Experimental Study and Taguchi Analysis on LED Cooling by Thermoelectric Cooler Integrated with Microchannel Heat Sink

An investigation on thermoelectric coolers operated with continuous current pulses

Design Optimization of Thermoelectric Cooling Systems for Applications in Electronic Devices

Experimental Study on Transient Cooling Characteristics of a Realistic Thermoelectric Module under a Current Pulse Operation

Experiment Investigation of A Two-Stage Thermoelectric Cooler under Current Pulse Operation

TEC Based Thermostat System for High-Power Semiconductor Laser

Research on Cooling System of High Power Semiconductor Laser Based on Thermoelectric Semiconductor Refrigerator

Design of a New Temperature Compensating System for High Power Circulator of EAST LHCD System

Cooling Technology for High Power Converter and Its Development

Thermal management of a flexible controlled thermoelectric energy conversion-utilization system using a multi-objective optimization

Performance optimization of the transient thermoelectric cooling for the temperature control of the chip working under dynamic power

Study on a Cascade Pulse Tube Cooler with Work Recovery

Performance enhancement of a novel thermoelectric self-cooling system for electronic devices

Design of VCSEL Laser Temperature Control Device

A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered

A High Efficiency Step-Up DC-DC Converter for Thermoelectric Generator with Wide Input Voltage Range

Efficient Thermoelectric Cooler for Localized Cooling in Electronic Devices

THE DEVELOPMENT OF PURE WATER COOLING SYSTEM FOR HIGH POWER CONVERTER

Investigation of a novel separately-configured micro-thermoelectric cooler to enabling extend application scope