Application of Moldflow Analysis to Optimizing Design of Parts with Metal Insert

Feng LI,Bao-qin SHENTU
DOI: https://doi.org/10.3321/j.issn:1005-5770.2007.09.011
2007-01-01
Abstract:Moldflow MPI 6.0 software was applied to analyse the warpage of the mobile phone housing with the metal insert.The warpage of the mobile phone housing was reduced effectively by optimizing the design of the metal insert,which could provide users with optimum design proposal.
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