Development of Intelligent Bind Device Based on MEMS Force Sensor

De-min CHEN,Wei ZHANG,Hao-nan ZHOU,Wei-zhen SHEN
DOI: https://doi.org/10.3969/j.issn.1001-9944.2014.02.004
2014-01-01
Abstract:In this paper,developed a intelligent bind device based on MEMS Force sensor. To conquer the collection of multi-axis sensor consistency and key technology such as anti-jamming,improved the process of using the measuring signal stability and reliability of the sensor,developed monolithic integrated multi-axis force of MEMS sensors,expounded the MEMS force sensor the processing technology;studied small size large powerful current control technology,completed intelligent goods bind device of the electric control system design;solved the complex electromagnetic environment of reliable transmission of wireless signals, to achieve the stable wireless data communication. The development of this device,provided a new cargo bound for logistics binding technology.
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