Abstract:High-performance polymeric materials with good processability and enhanced performance (higher thermal stability and mechanical strength, higher glass transition temperature (T-g) and lowered thermal expansion) have long been explored by scientists and engineers. The present study demonstrated a new way to fabricate high-performance polymers, such as polyarylamide (traditional polyarylamides can't be processed by melt processing due to the lack of viscous flow temperature before thermal decomposition), with excellent processability via a facile two-step process, i.e. low-temperature melt processing and a subsequent in-situ thermal curing. Through designing the structure of the BCB-containing precursors, we can well control the melting point and curing temperature, thus adjust the melt processing temperature and curing temperature of the polymers. In our experiments, the temperature difference between precursor melting point and polymerization temperature can be over 200 degrees C, providing wide processing window and long storage lifetime. Besides, these precursors also possess excellent solubility in organic solvents, which endow them with the possibility of solution or melt processing, as illustrated by the representative precursor, DODA-BCB. The obtained polymer resin films show good thermal stability (T-d,T-5% > 410 degrees C), high glass transition temperatures (T-g > 240 degrees C) and good mechanical strength (storage modulus > 1.8 GPa). Further studies on the thermal expansion behavior of the films reveal the thermal contracting feature of p-3,4'-ODA-BCB, the mechanism has been discussed in detail using DFT calculations, VT-FTIR and TMA.

Zero Thermal Expansion Polyarylamide Film with Reversible Conformational Change Structure

Large negative thermal expansion of a polymer driven by a submolecular conformational change

Design And Synthesis Of Thermal Contracting Polymer With Unique Eight-Membered Carbocycle Unit

Soluble, Thermally Stable, and Low Thermal Expansion Polyarylamides Enabled by a Seven-Membered Carbocycle

Thermal Conductivity of Polyvinylidene Fluoride Films with a Multi-Scale Framework

High-performance Polymers Adapted to Facile Melt Processing Through Structure Design of Benzocyclobutene-Containing Precursors

THE THERMAL OPTICAL PROPERTIES OF POLY (METHYL METHACRYLATE) SOLID FILMS DOPED BY AZO DYES

Confined Crystallization Polyether-Based Flexible Phase Change Film for Thermal Management

Design and Modulation of Negative Thermal Expansion for Epoxy Polymers

Thermally Stable and Mechanically Strong Mesoporous Films of Poly(ether Imide)-Based Triblock Copolymers

Influence of Conformational Change of Chain Unit on the Intrinsic Negative Thermal Expansion of Polymers

High-Performance Bismaleimide Resin with an Ultralow Coefficient of Thermal Expansion and High Thermostability

Unlocking giant negative thermal expansion through reversible conformational changes in regenerated silk fibroin film

Tuning Epoxy Thermomechanics via Thermal Isomerization: A Route to Negative Coefficient of Thermal Expansion Materials.

Preparation of flexible transparent acryl/alumina nano-hybrid materials exhibiting low thermal expansion coefficient

Adjusting Local Molecular Environment for Giant Ambient Thermal Contraction.

High thermal conductivity of liquid crystalline monomer‐poly (vinyl alcohol) dispersion films containing microscopic‐ordered structure

A homeotropic main-chain tolane-type liquid crystal elastomer film exhibiting high anisotropic thermal conductivity.

Reduced coefficient of linear thermal expansion of colorless and transparent polyimide by introducing rigid-rod amide unit: synthesis and properties

Synthesis and Characterization of Negative-Tone Photosensitive Polyimides with Low Coefficient of Thermal Expansion for Packaging Applications

Thermal Behavior of Poly(vinyl alcohol) in the Form of Physically Crosslinked Film