Strategic moderation of thermal stability and curing time of lignin-based phenolic resin by incorporating nanoparticles
Kaiyan YangYu ChenXiaowu GongLanli BaiYun ZhangNa Zhoua School of Chemistry and Chemical Engineering/State Key Laboratory Incubation Base for Green Processing of Chemical Engineering,Shihezi University,Shihezi,Chinab Key Laboratory of Bio-Based Material Science & Technology of Ministry of Education,College of Material Science and Engineering,Northeast Forestry University,Harbin,China
DOI: https://doi.org/10.1080/01694243.2024.2342713
IF: 2.431
2024-04-19
Journal of Adhesion Science and Technology
Abstract:In order to solve the problem of poor thermal stability of lignin-based phenolic resin (LPF), nanoparticles such as nano-SiO 2 , nano-Al 2 O 3 and nano-TiO 2 were used as modifiers to modify LPF. Fourier transform infrared spectroscopy (FT-IR) and X-ray diffraction (XRD) results showed that nano-SiO 2 , nano-Al 2 O 3 and nano-TiO 2 can be chemically cross-linked with LPF to form Si-O-Si, Al-O and Ti-O, respectively. Scanning electronic microscopy (SEM) results showed that after modifying by nano-SiO 2 (SLPF), nano-Al 2 O 3 (ALPF) and nano-TiO 2 (TLPF), the small copolymers were significantly reduced and the surface become flat and smooth. Thermogravimetric analysis (TGA) showed that at 800 °C, the thermal stability of SLPF, ALPF and TLPF increased by 4.28, 5.38 and 4.74%, respectively, compared with LPF, the reason was that the introduction of nanoparticles required more energy to be absorbed during thermal degradation. Differential scanning calorimetry (DSC) results showed that the curing temperature of the modified LPF remained basically unchanged, and the curing time was reduced.
materials science, multidisciplinary,engineering, chemical,mechanics