Special issue on vacuum insulation, fundamentals and applications [Guest Editorial]

Shenli Jia
DOI: https://doi.org/10.1109/TDEI.2017.007068
IF: 2.509
2017-01-01
IEEE Transactions on Dielectrics and Electrical Insulation
Abstract:IN the Special Issue, we are proud to present the expanded versions of selected papers presented at the 27th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV). It was held at Suzhou, China, from September 18 to 23, 2016. The International Symposia on Discharge and Electrical Insulation in Vacuum (ISDEIV) is a non-profit, international organization whose purpose is ...
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