Accurate self-heating assessment employing multi-stage thermal RC network

Wangyong Chen,Linlin Cai,Kunliang Wang,Xing Zhang,Xiaohui Liu,Gang Du
DOI: https://doi.org/10.1109/VLSI-TSA.2018.8403838
2018-01-01
Abstract:Multi-stage thermal RC network is extracted and verified from transient thermal response by 3D FEM simulation to accurately capture self-heating. The impact of material parameters on temperature response is investigated. Furthermore, electro-thermal analysis of devices with different thermal conductivities is implemented to study the dependence of AC frequency and power duty cycle on self-heating. The results show that self-heating is suppressed when the heating time is shorter than the time constant of substrate even if poor thermal conductivity of substrate is adopted.
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