Research on the Deformation Behavior of Ag-GNSs/SnAgCu Solders during Nanoindentation Tests

XU Lianyong,ZHANG Shuting,JING Hongyang,HAN Yongdian
DOI: https://doi.org/10.3901/JME.2018.08.151
2018-01-01
Journal of Mechanical Engineering
Abstract:The nanoindentation test is performed using constant loading methods on composite solders at room temperature to study the deformation behaviors at micro and nano scales.Through the analysis of the load-indentation depth curves and the indentation morphologies,the “pop-in” and the deformation mechanism is studied.The “pop-in” occurred in the load-depth curves and it is attributed to the elastic-plastic transitions.The transition is relevant to the nucleation of the dislocations.Many dislocation networks are observed around the indentation via TEM.The “pile-up” is found while observing the indentation morphologies,relevant to the ratio of Young's modulus and the yield stress.It results in a smaller result of the contact area and the values of the hardness and modulus is lager than reality.A semi-ellipse model is used to revise the result with “pile-up” and a new result of the hardness and Young's modulus is obtained based on the Oliver-Pharr method.The hardness is 18.3% lower that that before revising and the Young's modulus is 9.5% lower.
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