Abstract:Void nucleation, growth and coalescence have been identified as the leading cause of ductile damage in metallic materials. To understand the underlying deformation and damage mechanisms, extensive theoretical, experimental and simulation efforts have been attempted on spherically voided metals. In this work, molecular dynamics simulations are performed to analyze the uniaxial straining deformation behaviours of both single-crystal and nanotwinned copper materials embedded with a preexisting spheroidal void. The coupling effects among twin boundary, spheroidal void aspect ratio and orientation on unidirectional elastoplastic behaviours are systematically examined. The dislocation-induced plastic deformation mechanism is also examined and compared with the one due to a perfectly spherical cavity. Simulation results show that elastic modulus increases with both spheroidal void aspect ratio and orientation. So do the yield stress, the first peak stress and the plasticity index. Another peak stress exists for most cases, except for a prolate void embedded in nanotwinned specimens. The slope between peak stresses decreases with both the spheroidal aspect ratio and orientation. The incorporation of a twin boundary results in lower elastic modulus, higher yield strength and smaller plasticity index. For an oblate void, the twin boundary gives rise to more severe strain softening behaviour. The dislocation extraction algorithm illustrates that the continuous nucleation, propagation and reaction of dislocations emanated from both the void front and twin boundary are responsible for the ductile damage of spheroidally voided crystals. The lower dislocation densities found in nanotwinned specimens indicate the desired suppression effects of twin boundary on dislocation activities.

Void effect on mechanical properties of copper nanosheets under biaxial tension by molecular dynamics method

Molecular Dynamics Simulations of Void Effect of the Copper Nanocubes under Triaxial Tensions

Coupling Effect of Twin Boundary and Void on the Mechanical Properties of Bulk Nanotwinned Copper: an Atomistic Simulation

Void Configuration-Induced Change in Microstructure and Deformation Mechanisms of Nano-Porous Materials

Effect of Void Size and Position on Mechanical Properties of Nanotwinned Metals under Cyclic Loading

Effects of Void Shape and Orientation on the Elastoplastic Properties of Spheroidally Voided Single-Crystal and Nanotwinned Copper

MD Investigations for Mechanical Properties of Copper Nanowires with and Without Surface Defects

Effect of Void on Yielding Behaviors in a Bicrystalline Copper

Molecular dynamic simulation for uniaxial tension properties of bicrystal Cu with spherical void

Molecular dynamics simulation on elastoplastic properties of the void expansion in nanocrystalline copper

Atomistic Simulation Analysis of the Effects of Void Interaction on Void Growth and Coalescence in a Metallic System

Molecular dynamics study of cylindrical nano-void growth in copper under uniaxial tension

Atomic Simulation of Void Location Effect on the Void Growth in Nickel-Based Single Crystal

Molecular Dynamics Simulations of Single Crystal Copper Nanocubes under Triaxial Tensile Loading

Molecular Dynamics Simulation of Void Growth in Single Crystal Copper under Uniaxial Impacting

Atomic Simulation of Void Effect on the Microstructure Evolution and Internal Stress Transmission in Nanoindentation

Investigation on void growth and coalescence in single crystal copper under high-strain-rate tensile loading by atomistic simulation

Molecular Dynamics Study on Mechanical Behaviors of Ti/Ni Nanolaminate with a Pre-Existing Void

Molecular Dynamics Study on the Nano-Void Growth in Face-Centered Cubic Single Crystal Copper

On the Ductile Damage of Nanotwinned Copper Crystal with Prolate Void Defect at the Twin Boundary

Multiaxial Behavior of Nanoporous Single Crystal Copper: a Molecular Dynamics Study