Joint IEEE Young Professionals Meet at EPE'17-ECCE Europe [society News]

Yongheng Yang,Piotr Graca

DOI: https://doi.org/10.1109/mpel.2017.2784218

2018-01-01

IEEE Power Electronics Magazine

Abstract:Presets information on the Young Professional meeting held at EPE 2017 Europe.

What problem does this paper attempt to address?

Students and Young Engineers Meeting Held at IPEC 2018-ECCE Asia [society News]

Ryuji Iijima,Yoshikazu Kuwabara,Daiki Yamaguchi,Yuta Yanagisawa,Yoshihiro Miwa,Hidemine Obara,Yongheng Yang

DOI: https://doi.org/10.1109/mpel.2018.2852438

2018-01-01

IEEE Power Electronics Magazine

Abstract:Presents information on the Students and Young Engineers Meeting held at IPEC 2018.
Young Professionals and Women in Engineering Reception at 2017 IFEEC ECCE Asia [society News]

Katherine A. Kim,Yu-Chen Liu,Yongheng Yang

DOI: https://doi.org/10.1109/mpel.2017.2762212

2017-01-01

IEEE Power Electronics Magazine

Abstract:Presents information the Young Professionals and Women in Engineering Reception at 2017 IFEEC ECCE Asia.
A New Event: IEEE PELS Student Symposium on Power Electronics—Asia [students and Young Professionals Rendezvous]

Hongyi Chen,Zhiheng Lin,Rujing Zhang,Min Chen,Kai Sun,Bruna Seibel Gehrke,Joseph P. Kozak

DOI: https://doi.org/10.1109/mpel.2024.3397183

2024-01-01

IEEE Power Electronics Magazine

Abstract:The second IEEE Power Electronics Society (PELS) Students Symposium on Power Electronics (SSPEL)—Asia 2024 was successfully held in Hangzhou, China, from 13 to 14 January 2024 with both in-person and virtual attendees. The event was organized through the joint efforts of the IEEE PELS Membership Committee—China (MCC), PELS Zhejiang/Jiangsu/Anhui Chapter, and PELS Zhejiang University Student Branch Chapter (SBC), with technical co-sponsorship of the China Power Supply Society (CPSS), as well as seven SBCs and the IEEE PELS Students and Young Professional (S&YP) Committee. The Symposium attracted 478 students and young professionals from seven countries, including, but not limited to, China, Singapore, and South Korea ( Figure 1 ).
IEEE PELS Students and Young Professionals Symposium 2023 Overview [students and Young Professionals Rendezvous]

Fei Wang,Chen Xu,Xiaokang Zhang,Kai Sun,Zhiheng Lin,Nayara Brandao de Freitas,Joseph P. Kozak

DOI: https://doi.org/10.1109/mpel.2023.3325955

2023-01-01

IEEE Power Electronics Magazine

Abstract:The IEEE Power Electronics Society (PELS) constantly provides its members, volunteers, and the entire technical community with a wide range of academic event platforms and assistance. Organized by the IEEE PELS, the second IEEE PELS Students and Young Professionals Symposium (SYPS 2023), was successfully held in Shanghai, China, from 27 to 29 August.
IEEE Industrial Electronics Society Students & Young Professionals: Exploring New Countries and Making New Friends [Students and Young Professionals News]

Dmitri Vinnikov

DOI: https://doi.org/10.1109/mie.2023.3323908

IF: 8.36

2023-12-01

IEEE Industrial Electronics Magazine

Abstract:Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.

engineering, electrical & electronic
PELS Digital Media/Education Committee Announces Yearly Activities [society News]

Prasad Enjeti,Arijit Banerjee,Yongheng Yang

DOI: https://doi.org/10.1109/mpel.2020.3011781

2020-01-01

IEEE Power Electronics Magazine

Abstract:Reports on the mission and activities of the PELS Digital Media and Education Committee. It’s primary objective is to contribute, support, and lead this mission by disseminating knowledge, fostering engagement, and creating excitement among IEEE PELS members, the engineering and scientific community, and the general public. In keeping with the mission, the Committee organized a number of activities this year.
IEEE PELS Online Webinar Series Launches [Society News]

Yongheng Yang,Prasad Enjeti

DOI: https://doi.org/10.1109/MPEL.2019.2960671

2020-01-01

IEEE Power Electronics Magazine

Abstract:Presents information on PELS online Webinar series.
IEEE CASS/EDS/SSCS Wuhan Joint Chapter and CASS IEEE Macau Chapter Organize an Outreach Online Seminar [Chapters]

Yi Zhan,Jun Yin,Chao Wang

DOI: https://doi.org/10.1109/MSSC.2021.3072183

2021-01-01

IEEE Solid-State Circuits Magazine

Abstract:Presents information on various CASS/EDS/SSCS Society chapters.
Students & Young Professionals of the IEEE Industrial Electronics Society (IES) at the 24th IEEE International Conference on Industrial Technology 2023: It Is Also a Strategic Priority of IES for the Next Decade! [Students and Young Professionals News]

Dmitri Vinnikov

DOI: https://doi.org/10.1109/mie.2023.3297351

IF: 8.36

2023-09-01

IEEE Industrial Electronics Magazine

Abstract:Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.

engineering, electrical & electronic
IEEE Industrial Electronics Society Holds Vision 2030 Workshop [Society News]

scar Luca,Milos Manic,Óscar Lucía

DOI: https://doi.org/10.1109/mie.2023.3300068

IF: 8.36

2023-09-01

IEEE Industrial Electronics Magazine

Abstract:Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.

engineering, electrical & electronic
Chair Message

Daniel Weiskopf,Yingcai Wu,Tim Dwyer,Yun Jang,Naohisa Sakamoto

DOI: https://doi.org/10.1109/pacificvis.2017.8031566

2017-01-01

Abstract:Welcome to the proceedings of the IEEE Pacific Visualization Symposium 2017 (IEEE PacificVis 2017), tenth in a series of successful events that have been sponsored by the IEEE Computer Society Visualization and Graphics Technical Committee (VGTC). Past IEEE PacificVis symposia were held in Kyoto (2008), Beijing (2009), Taipei (2010), Hong Kong (2011), Songdo (2012), Sydney (2013), Yokohama (2014), Hangzhou (2015), and Taipei (2016). This year, PacificVis is held at Seoul, Korea from April 18 to 21, 2017, hosted by Seoul National University.
Proceedings of 2019 IEEE PES Innovative Smart Grid Technologies Europe (ISGT-Europe)

DOI: https://doi.org/10.1109/isgteurope.2019.8905614

2019-09-01

Abstract:Proceedings of 2019 IEEE PES Innovative Smart Grid Technologies Europe (ISGT-Europe)
Editorial for the JEDS Special Issue for EDTM 2021

Shuji Ikeda,Yi Li,Durga Misra,Arokia Nathan,Bich-Yen Nguyen,Qiming Shao,Charles Surya,Jianshi Tang,Albert Wang,Hitoshi Wakabayashi,Huaqiang Wu,Chen Yang,Bin Zhao

DOI: https://doi.org/10.1109/jeds.2021.3132406

2021-01-01

IEEE Journal of the Electron Devices Society

Abstract:This Special Issue of the IEEE Journal of Electron Devices Society is a selection of papers presented at the 2021 IEEE Electron Devices Technology and Manufacturing (EDTM) Conference. Sponsored by IEEE Electron Devices Society (EDS), IEEE EDTM is a premier conference providing a unique forum for discussions on a broad range of device/manufacturing-related topics. EDTM rotates among the hot-hubs of semiconductor manufacturing in Asia. EDTM2021 was successfully held in Chengdu, China, during March 9-12, 2021. The Theme for EDTM2021 was Intelligent Technologies for Smart and Connected Life . Due to the pandemic, EDTM2021 was held in hybrid formats including a large onsite/in-person gathering and a virtual conference. EDTM2021 was a four-day conference comprising a one-day tutorial/short course/workshop event and a three-day technical program including both oral and poster sessions. On Day-1, EDTM2021 was kicked off with two parallel tutorial tracks and four concurrent short course sessions. The two tutorial series focused on “Flexible electronics + Display” and “Future Communication and Computing.” The four short course sessions covered “Advanced Memories and Emerging Applications,” “Quantum Computing Technologies,” “Advanced Processing and Manufacturing” and “Ultra/Wide Bandgap Power Electronics.” Total twelve lectures were given by globally renowned experts. The highlight on Day-1 also includes the “HIR Workshop Organizing Committee” organized by the IEEE Heterogeneous Integration Roadmap Committee and featured by eighteen experts from around the globe discussing the advances, challenges and future of HI technologies. EDTM2021 Technical Program includes six Keynote Speakers talking about various hot topics, including Dr. Haijun Zhao (Co-CEO of SMIC) on “Creating Values through Innovations on Mature Nodes of Technologies of Integrated Circuits,” Prof. Xiang Zhang (President, University of Hong Kong) on “How to build a camera with highest resolution: a photonics perspective,” Mr. Teruo Hirayama (Executive Chief Engineer, Sony Corp.) on “The power of image sensors for innovation,” Prof. Arokia Nathan (University of Cambridge) on “Thin Film Transistor Architectures for Advanced Analog Signal Processing,” Prof. Ru Huang (Vice President, Peking University) on “Ferroelectric-based device: revived as a low-power technology booster for diverse applications” and Dr. Jeff Xu (Director, HiSilicon Research) on “Ubiquitous Computing Drives Future Semiconductor Technology.” The Plenary was closed with a Closing Banquet Speech given by Prof. Ilesanmi Adesida (Provost, Nazabaryev University) entitled “The Development of an International Research University in the Big Steppe of Kazakhstan.” EDTM2021 Technical Program core contains about 289 technical papers accepted after strict peer reviewing, including 172 oral (organized into 36 Sessions) and 117 interactive presentations. EDTM2021 had a total registered attendance of 800+, including 492 for the Technical Program (283 in-person and 209 virtual), 156 for Tutorials and 158 for Short Courses.
Enrich Your Horizon With IEEE EMBS Student Mentoring Program

Muhammad Fairuziko Nurrajab,Nyi Nyi Tun

DOI: https://doi.org/10.1109/mpuls.2024.3354591

IF: 0.622

2024-02-23

IEEE Pulse

Abstract:In order to align with the original goals of the IEEE organization's IEEE Mentoring Meeting, the IEEE EMBS Student Activities Committee (IEEE EMBS SAC) is now shaping the Student Mentoring Program (SMP) for EMBS members. The SMP, a student-led initiative by the Student Activities Committee (SAC), is an annual series of events that aim to offer a support network for students to connect with experienced professionals that align with their interests all over the world [1], [2]. The program is a part of the Professional Development Portfolio along with other programs under IEEE EMBS SAC [3], [4]. It is aimed at promoting the skills and professional development of students and young professionals in the IEEE EMB Society. Matching the mentee(s) and a mentor based on the same area of research interest (AOI) for reaching their goals is the main significance of the program. This article will explain the experience and achievements from both sides of being a mentor and a mentee in SMP 2022.

engineering, biomedical
Engineering Adaptive Software Systems: Communications of NII Shonan Meetings

Yijun Yu,Arosha Bandara,Shinichi Honiden,Zhenjiang Hu,Tetsuo Tamai,Hausi Muller,John Mylopoulos,Bashar Nuseibeh

2019-01-01

Abstract:The first Shonan Meeting on Engineering Adaptive Systems (EASy)[1], which was held in 2012, generated heated discussions on the problems and challenges about self-managing systems. Participants from multiple disciplinaries reached the consent that EASy has by no means an easy solution in software engineering alone, not to mention many other challenges in general system engineering. The organisers of the following Shonan meetings [2, 3] decided to focus on the problems and solutions that can help engineer adaptive software, hence a change of the focus to Engineering Adaptive Software Systems (EASSy). The technical reports above have gathered from abstracts of all individual participants; however, there has not yet been a full report on the crux of interesting viewpoints, which could collaboratively pave the way to solve some aspects of the long-standing research problems.This book is a collection …
2023 IEEE Industrial Electronics Society Awards [Society News]

scar Luca,Óscar Lucía

DOI: https://doi.org/10.1109/mie.2023.3323270

IF: 8.36

2023-12-01

IEEE Industrial Electronics Magazine

Abstract:Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.

engineering, electrical & electronic
IEEE Sections Congress and CASS Workshop Ottawa

Ricardo Reis,Hai Li,Manuel Delgado-Restituto

DOI: https://doi.org/10.1109/mcas.2024.3349728

IF: 4.04

2024-03-08

IEEE Circuits and Systems Magazine

Abstract:The IEEE Sections Congress is organized every three years, with the participation of section chairs from all over the world. The 2023 edition was organized in Ottawa, Canada, and CASS participated with a booth and as a Sponsoring Society. The opportunity was taken to organize a CASS Workshop at the CASS Ottawa Chapter.

engineering, electrical & electronic
Message from the VIS Paper Chairs and Guest Editors Preface

Tim Dwyer,Niklas Elmqvist,Brian Fisher,Steven Franconeri,Ingrid Hotz,Robert M. Kirby,Shixia Liu,Tobias Schreck,Xiaoru Yuan

DOI: https://doi.org/10.1109/tvcg.2017.2752518

IF: 5.2

2018-01-01

IEEE Transactions on Visualization and Computer Graphics

Abstract:EditorsThis January 2018 issue of the IEEE Transactions on Visualization and Computer Graphics contains the proceedings of IEEE VIS 2017, held during 1-6 October 2017. In 2017, IEEE VIS returns to the city of Phoenix, AZ, USA, for the conference's 28th year. The conference will be held at the Hyatt Regency Phoenix hotel. VIS consists of three conferences, held concurrently: the IEEE Visual Analytics Science and Technology Conference (VAST 2017), the IEEE Information Visualization Conference (InfoVis 2017), and the IEEE Scientific Visualization Conference (SciVis 2017). Information on the paper review process is provided along with an overview of each conference.
ICEBE 2010 Organizing Committee

Lionel M. Ni,Yueting Chai,Jen-Yao Chung,Yinsheng Li,Hui Lei,Wei Sun,Xiangyu Wang,Jingzhi Guo,Xiaohong Jiang,Yan Wang,Zongwei Luo,Murray Campbell,Ying Chen,Kuo-Ming Chao,Ci-Wei Lan

DOI: https://doi.org/10.1109/icebe.2010.7

2010-01-01

Abstract:Publication Chairs Kantilal Joshi, India Dinesh Padole, India Plenary Session Chairs Iven Jose, India Sanjay Pokle, India Computer Assistance Chairs Ganesh Padole, India Mangesh Bedekar, India Urmila Shrawankar, India Tour & Transport Gautam Bacher, India K. V. R. B. Prasad, India Mahadev Gawas, India Raghvendra G. S., India Sanjay Dorle, India Sarang Dhongdi, India Uday Wankhede, India Inauguration & Venue Arrangements A. Amalin Prince, India K. R. Anupama, India Meetha Shenoy, India Meghanand Bhamare, India Vinita George, India Helpdesk Dinesh K., India Nitin Sharma, India Prashanth S., India General Co-Chair Prashant Nagarnaik,India Program Chairs Andre Carvalho,Brazil, Guoyin Wang, China K. R. Anupama,BITS, India Santosh Jaju, India Tzung Pei Hong, Taiwan Regular Session Chairs Anjali Mahajan, India C. K. Ramesha, India Latesh Malik, India Rajesh Metkar, India Finance & Registration Sanjay Wankhede,India Anita Agrawal, India Aruna Govada, India Smita Nirkhi, India Publicity, Posters & Banners C. K. Ramesha, India Iven Jose, India Lucy Gudino, India Nitin Upadhya, India Sheron Figarado, India Local Arrangements Bharat Deshpande, India Ch. S. Sankhar Reddy, India Dinesh Padole, India G. Deepa, India Milind Khanapurkar, India Pramod Walke, India International Co-Chair Amol Deshmukh, India International Advisory Board Badr Youakim, France Bhavsar V., Canada Deb Kalyanmoy, India Desai U. B., India Fatos Xhafa, Spain G. Ragurama, India Hideyuki Takagi, Japan Hira Raju, India Hong T. P., Taiwan Janusz Kacprzyk, Poland Keskar Avinash, India Kher Shubhalaxmi, USA Koeppen Mario, Japan Koji MURAI, Japan Goel L. Kumar, Singapore Gruver William, Canada Pal Surendra, India Pan Jeng Shyang, Taiwan Patrick Kane, California Sharma D., Australia Shu Ching Chen, USA Snasel Vaclav, C. Republic Stuart Rubin, USA S. C. Dutta Roy, India Trivedi Mohan, USA Tzung Pei Hong, Taiwan Yager Ronald R., USA Zhang Chengqi, Australia
Proceedings of the IEEE

DOI: https://doi.org/10.1109/tac.2020.2969133

IF: 6.549

2020-02-01

IEEE Transactions on Automatic Control

Abstract:Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.

automation & control systems,engineering, electrical & electronic

Joint IEEE Young Professionals Meet at EPE'17-ECCE Europe [society News]

Students and Young Engineers Meeting Held at IPEC 2018-ECCE Asia [society News]

Young Professionals and Women in Engineering Reception at 2017 IFEEC ECCE Asia [society News]

A New Event: IEEE PELS Student Symposium on Power Electronics—Asia [students and Young Professionals Rendezvous]

IEEE PELS Students and Young Professionals Symposium 2023 Overview [students and Young Professionals Rendezvous]

IEEE Industrial Electronics Society Students & Young Professionals: Exploring New Countries and Making New Friends [Students and Young Professionals News]

PELS Digital Media/Education Committee Announces Yearly Activities [society News]

IEEE PELS Online Webinar Series Launches [Society News]

IEEE CASS/EDS/SSCS Wuhan Joint Chapter and CASS IEEE Macau Chapter Organize an Outreach Online Seminar [Chapters]

Students & Young Professionals of the IEEE Industrial Electronics Society (IES) at the 24th IEEE International Conference on Industrial Technology 2023: It Is Also a Strategic Priority of IES for the Next Decade! [Students and Young Professionals News]

IEEE Industrial Electronics Society Holds Vision 2030 Workshop [Society News]

Chair Message

Proceedings of 2019 IEEE PES Innovative Smart Grid Technologies Europe (ISGT-Europe)

Editorial for the JEDS Special Issue for EDTM 2021

Enrich Your Horizon With IEEE EMBS Student Mentoring Program

Engineering Adaptive Software Systems: Communications of NII Shonan Meetings

2023 IEEE Industrial Electronics Society Awards [Society News]

IEEE Sections Congress and CASS Workshop Ottawa

Message from the VIS Paper Chairs and Guest Editors Preface

ICEBE 2010 Organizing Committee

Proceedings of the IEEE