Piezoelectric Micromachined Ultrasonic Transducers with Low Thermoelastic Dissipation and High Quality Factor

Xuying Chen,Xinxin Liu,Tao Wang,Xianhao Le,Fangyi Ma,Chengkuo Lee,Jin Xie
DOI: https://doi.org/10.1088/1361-6439/aab1bc
2018-01-01
Journal of Micromechanics and Microengineering
Abstract:Thermoelastic dissipation is one of the main dissipative mechanisms in piezoelectric micromachined ultrasonic transducers (pMUTs). In this paper, we firstly propose pMUTs with etching holes to decrease thermoelastic dissipation and enhance quality factor (Q). The etching holes effectively disturb heat flow, and thus reduce thermoelastic loss. Working mechanism based on the Zener’s model is interpreted. The experiment results show that the Q of pMUT with three rows of holes is increased by 139% from 2050 to 4909 compared with the traditional one. Temperature coefficient of frequency (TCF) and vibration performance are also improved. The enhanced pMUT can be widely used in measurement of Doppler shift and relative high power applications.
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