Abstract:In recent years, electronic packaging has evolved significantly to meet demands for higher performance, lower costs, and smaller designs. This shift has led to heterogeneous packaging, which integrates chips of varying stack heights and results in non-uniform heat flux and temperature distributions. These conditions pose substantial thermal management challenges, as they can create large temperature gradients, which increase thermal stress and potentially compromise chip reliability. This study explores single-phase liquid cooling for multi-chip modules (MCMs) through a comprehensive experimental and machine learning approach. It investigates the impact of chip spacing, height, fluid flow rate, fluid inlet location, and heat flux uniformity on chip temperature and the thermohydraulic performance of a commercial cold plate. Results show that increasing coolant flow from 1 LPM to 2 LPM decreased thermal resistance by 26 %, with heat losses remaining below 5 %. The left inlet configuration improved temperature uniformity compared to the right, though both yielded comparable thermal performance. Adjusting heater spacing impacted temperature distribution based on inlet position, and lowering one heater by 1 mm raised its temperatures by 15 °C due to increased thermal resistance from thermal interface material. A transient test demonstrated the cold plate's quick response to power surges, in which there is only a 1 °C spike above steady state. Complementing these findings, an Artificial Neural Network (ANN) model was developed with optimized architecture specifically for the unique challenges of this study. The ANN model was rigorously validated using an independent dataset, achieving highly accurate temperature predictions (R2 = 0.99) within 2.5 % of experimental values, which demonstrates this framework's potential for optimizing MCM thermal performance.

Analytical Solutions of Temperature Distributions Based on Fourier Series for Wafer Level Heterogeneous Integrations

Calculations of Temperature Distributions for Power MMICs in 3-D Packages

Modeling Of Two-Dimensional Dynamic Temperature Distribution Of A Lpcvd Process And Control Design By Mpc

Electromagnetic-Thermal Characterization Of On On-Chip Coupled (A)Symmetrical Interconnects

Thermal-aware electrical analysis of high-speed interconnect

Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration

Thermal Analysis of Power MMICs Based on Computerization.

Thermal-mechanical analysis of packaged power amplifiers based on heterogeneous integrations using photosensitive BCB

Modeling and Characterization of Joule Heating in Metal Core of Tsv

One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin.

Frequency-Domain Thermal Modeling of Power Modules Based on Heat Flow Spectrum Analysis

A Thermal Network Model for Multichip Power Modules Enabling to Characterize the Thermal Coupling Effects

Integrated Manifold Microchannels and Near-Junction Cooling for Enhanced Thermal Management in 3D Heterogeneous Packaging Technology

Thermal challenges in heterogeneous packaging: Experimental and machine learning approaches to liquid cooling

Thermal Design, Analysis and Verification of Chip-Level MCM with Properties of Semiconductor Materials

A Novel Analytical Thermal Model for Temperature Estimation of Multilevel ULSI Interconnects

A Fast Steady-state Thermal Modeling of Power Modules Based on Fourier Analytic Series

Thermal analysis and heat dissipation optimization of 3D packaging with TSV interposer

Wafer Level Heterogeneous Integration of a Transceiver Module in Millimeter Wave Using Photosensitive BCB

Frequency-Domain Thermal Coupling Model of Multi-Chip Power Module

Analysis and Modelling of Non-Fourier Heat Behavior Using the Wavelet Finite Element Method