Effect of minor Cu addition on corrosion behavior of Sn-Zn-xCu touch-up solder alloys

H.-T. Peng,Chunshan Che,Gang Kong
DOI: https://doi.org/10.1002/maco.201609313
2017-01-01
Abstract:The corrosion behavior of Sn-50Zn-xCu (x=0, 1, 2wt%) touch-up solder alloys was investigated by electrochemical techniques (potentiodynamic polarization, electrochemical impedance spectroscopy, and open circuit potential) and surface characterization (scanning electron microscopy, energy dispersive X-ray spectrometry, and X-ray diffraction), aiming to explore the effects of the Cu addition on the corrosion resistance. The results reveal that the dendritic-like Zn-rich phase of Sn-50Zn was disadvantageous to form a protective corrosion product layer and offered convenient paths for the Cl- penetration into the substrate. However, the Cu addition to Sn-50Zn based alloys led to the refinement of microstructure and the transformation of Zn-rich phase's morphology which could result in the formation of more compact corrosion product layer. Thus, the corrosion resistance of Sn-Zn-Cu alloys was improved. The corrosion mechanism is also discussed.
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