Enhanced Ideal Strength of Thermoelectric Half-Heusler TiNiSn by Sub-Structure Engineering

Guodong Li,Qi An,Umut Aydemir,William A. Goddard,Max Wood,Pengcheng Zhai,Qingjie Zhang,G. Jeffrey Snyder
DOI: https://doi.org/10.1039/c6ta04123j
IF: 11.9
2016-01-01
Journal of Materials Chemistry A
Abstract:In realistic applications, high strength, high toughness TiNiSn based TE devices are required.
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