Abstract:Recently, quaternary ammonium salt is considered as an effective leveler because of its easy adsorption on the cathode surface. However, quaternary ammonium salt compounds usually have a variety of functional groups with different structures, which may bring different adsorption effects. In this paper, three kinds of benzyl-containing quaternary ammonium compounds with different side chains, i.e., benzyl trimethyl ammonium chloride, tetradecyl dimethyl benzyl chloride ammonium chloride and benzethonium chloride, were selected as potential levelers for microvia overfilling of PCB with high-density interconnect. The wettability and the electrochemical behavior of the three levelers on copper deposition were studied through contact angle measurements and cyclic voltammetry striping tests. It was found that among the three kinds of quaternary ammonium salts, benzethonium chloride (BZC) with three side chains of ether bond, alkyl and benzene ring has the most significant inhibitory effect on copper deposition. Electrochemical tests including cyclic voltammetry striping (CVS) and linear sweep voltammetry (LSV) performed at two different speeds that simulates the microvia filling environment were then used to analyze the effect of the addition concentration of BZC as leveler on the deposition behavior of copper to make sure an optimal concentration. Subsequently, the effect of BZC as leveler on the electrodeposition behavior of copper under the synergistic action of conventional accelerator, suppressor and chloride ion was further analyzed by comparing with traditional leveler based on GM and LSV. The results show that under the synergistic action of other additives, this BZC produces greater inhibition of copper deposition than the traditional JGB, has more obvious convection-dependent adsorption behavior and forms a larger potential difference to meet the super filling. Filling experiment further shows that BZC as a leveler had an excellent filling performance. In addition, Field emission scanning electron microscopy (FE-SEM) and X-ray diffraction (XRD) were used to analyze the surface morphology and crystal structure of microvia filled copper at different concentrations of BZC. The present results show that benzyl ammonium chloride with ether bond, alkyl and benzene ring is an effective leveler for the microvia filling of PCB.

Polyquaternium-2: A New Levelling Agent for Copper Electroplating from Acidic Sulphate Bath

Numerical and Experimental Investigation of 2-Thiazoline-2-thiol and Nitrotetrazolium Blue Chloride Compound As Levelers for Through-Hole Copper Electroplating

Unveiling the Potential and Mechanisms of 3,3'-Bicarbazole-Based Quaternary Ammonium Salts as Levelers

Electrochemical Analysis of Cathode in TSV Copper Electroplating

Influence of Branched Quaternary Ammonium Surfactant Molecules As Levelers for Copper Electroplating from Acidic Sulfate Bath

Benzyl-Containing Quaternary Ammonium Salt as a New Leveler for Microvia Copper Electroplating

Synthesis of coplanar quaternary ammonium salts with excellent electrochemical properties based on an anthraquinone skeleton and their application in copper plating

Synthesis of Quinacridone Derivatives and Their Application As High Performance Levelers in Electroplating

Pentaerythritol-Based Compound as a Novel Leveler for Super-Conformal Copper Electroplating

Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole

Synthesis of Quaternary Ammonium Salts Based on Diketopyrrolopyrroles Skeletons and Their Applications in Copper Electroplating.

Investigation of Synthesized Carbazole Derivative Cz-BPDB As a High-Performance Leveler for Copper Electroplating

Synthesis and Application of Anthraquinone Quaternary Phosphonium Salt Electroplating Copper Leveler Based on Expanded Electrostatic Adsorption Area Strategy and Physicochemical Salt Bridge Mechanism

A Hybrid Additive with Both Suppressor and Leveler Capability for Damascene Copper Electrodeposition

Strong Convection-Dependent Adsorption of Phenothiazine Skeleton Levelers and Their Application in Copper Electroplating

Computational analysis and experimental evidence of two typical levelers for acid copper electroplating

Investigation on Synthesis and Mechanism of a Sudan Ⅰ Copper Electrodeposition Leveler Based on Influencing Ion Diffusion Strategy

Bisphenol A Polyoxyethylene Ether Sodium Sulfate as a New Leveler for Electrodeposition of Copper

Synthesis and mechanism of quaternary ammonium salts based on porphyrin as high-performance copper levelers

Aryl Modification of Diketopyrrolopyrrole-Based Quaternary Ammonium Salts and Their Applications in Copper Electrodeposition

Electrochemical behaviors of additives in high Cu(II) concentration solution for high-aspect-ratio through ceramic holes filling