Stress Field Around Crack Tip Inside Thin Current-Carrying Plate

田振国,郑坚,白象忠
DOI: https://doi.org/10.3969/j.issn.1007-791x.2004.06.006
2004-01-01
Abstract:In this paper, a thin current-carrying plate with a penetrated crack is analysed when an instant electric current is switched on. Complex analysis method is used to propose the way of how to calculate the point heat source which is formed owing to the heat concentration effect on the crack tip. Furthermore, the temperature field and the stress field near the crack leading edge are also deduced. Theoretical analysis and experimental surreys show that if the electric current density is controlled, the material around the crack tip will melt due to the heat concentration effect, at the same time the super passive tissue and the compressive stress around the crack tip can prevent the crack from propagating. The influence of heat transfer coefficient varying with tempera- ture on stress field is also discussed.
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