Study on the Ni-Zn Ferrite Material and Process Used for Chip Anti-EMI Filters

周海涛,张怀武
DOI: https://doi.org/10.3969/j.issn.1001-3830.2003.04.003
2003-01-01
Abstract:By adding CuO and Bi2O3 to Ni-Zn ferrites, the sintering temperature is decreased to a range of 870 to 920℃, which makes it possible the co-sintering of Ni-Zn ferrites and Ag electrode. As a result, chip anti-EMI filters were prepared that are suitable for high density surface mounted technology and broad frequency anti-electromagnetic interference applications.
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