FTIR Analyses of SiOF Thin Film with Low Dielectric Constant

王鹏飞,丁士进,张卫,张剑云,王季陶,李伟
DOI: https://doi.org/10.3969/j.issn.1000-3819.2001.04.017
2001-01-01
Abstract:SiOF thin films with low dielectric constant were deposited using TEOS/O 2/SiF 4 mixtures in a plasma enhanced chemical vapor deposition system. Through the FTIR (Fourier Transform Infrared Spectrometry) analyses, the changes in chemical structure of SiOF film are studied, Further more, the dependence of dielectric constant and water resistibility of thin film on the chemical structure after F doping is also discussed. It is found that the incorporation of F atoms change the partial charge of atoms in Si O band, and the polarity of Si O bond is reduced. The Si OH bonds with high polarity also decrease as a result of F doping. These changes in structure contribute to the decrease of the dielectric constant of SiOF film. In addition, it is found that SiOF films with high F content comprise SiF 2 structures, which are easy to react with water to degenerate SiOF thin fims.
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