Reliability Technology of MEMS

冯亚林,李莉,李霁红,郝一龙

DOI: https://doi.org/10.3969/j.issn.1671-4776.2002.03.008

2002-01-01

Abstract:One of the key for successful application of MEMS is in proving its reliability.In this pa-per,the reliability testing require for MEMS and reliability testing system ShiMMeR were analyzed,reliability experiments and failure modes of MEMS were summarized,and reliability design for MEMS was discussed.

What problem does this paper attempt to address?

MEMS Reliability Review

Yunhan Huang,Arvind Sai Sarathi Vasan,Ravi Doraiswami,Michael Osterman,Michael Pecht

DOI: https://doi.org/10.1109/tdmr.2012.2191291

IF: 1.886

2012-06-01

IEEE Transactions on Device and Materials Reliability

Abstract:Microelectromechanical systems (MEMS) represents a technology that integrates miniaturized mechanical and electromechanical components (i.e., sensors and actuators) that are made using microfabrication techniques. MEMS devices have become an essential component in a wide range of applications, ranging from medical and military to consumer electronics. As MEMS technology is implemented in a growing range of areas, the reliability of MEMS devices is a concern. Understanding the failure mechanisms is a prerequisite for quantifying and improving the reliability of MEMS devices. This paper reviews the common failure mechanisms in MEMS, including mechanical fracture, fatigue, creep, stiction, wear, electrical short and open, contamination, their effects on devices' performance, inspection techniques, and approaches to mitigate those failures through structure optimization and material selection.

engineering, electrical & electronic,physics, applied
Research Status of Macro-Modeling of MEMS Devices for Systems Level Simulations

林谢昭,应济

DOI: https://doi.org/10.3969/j.issn.1000-9787.2008.04.003

2008-01-01

Abstract:The key of commercial successes of MEMS rests with computer aided methodology in the field of MEMS design and manufacture.The reason that causes MEMS design complexity and hardship is discussed.The hierarchy of MEMS CAD is introduced.The state of research in MEMS macro-modeling approaches at home and abroad are also introduced and summed up.The emphases are aimed at the MEMS devices compact-modeling(order-reduced modeling) methods and the macro-model's representation.The two keystones in the nonlinear macro-modeling are the representation of the original system's nonlinear characteristics and the realization of automatic model reduction.Some suggestions for the further researches are proposed
Reliability of MEMS: A perspective on failure mechanisms, improvement solutions and best practices at development level

Jacopo Iannacci

DOI: https://doi.org/10.1016/j.displa.2014.08.003

IF: 3.074

2015-04-01

Displays

Abstract:Reliability of MEMS (MicroElectroMechanical-Systems) devices is a crucial aspect as it can discriminate the successful from partially or totally missed reaching of Microsystem technology based market products. However, the topic of MEMS reliability is significantly articulated, as it comprises numerous physics of failure and diverse failure mechanisms. Thereafter, it requires a pronounced sensitivity related to the actual operation conditions (environmental and functional) of the Microsystem device within the final application. In other words, reliability of MEMS is nowadays regarded as a standalone transversal discipline that must be seriously taken into account already from the early design phase. The purpose of this paper is to provide the reader at first with basic knowledge around the concept of reliability. Thereafter, the most relevant physics of failure and failure mechanisms typical of MEMS are grouped and briefly discussed, with specific attention to their employment in the field of displays. A synthetic review of valuable solutions to improve specific reliability aspects of MEMS devices for diverse applications is then proposed to the reader. Eventually, a brief discussion focused on best practices to address properly reliability during the whole development chain of innovative MEMS based products completes the contribution. It is a belief of the author that the particular blend of topics and aspects reported in the following pages, as well as the attitude of considering reliability as a transversal discipline of science, contribute to provide this contribution with an important benefit if compared to the reviews on reliability of MEMS previously published in literature.

engineering, electrical & electronic,instruments & instrumentation,optics,computer science, hardware & architecture
Computational Analysis of Mechanical and Electromigration Reliability Problems

I. Avci,P. Balasingam,V. Chawla,K. El-Sayed,M. D. Johnson,A. Kucherov,S. Li,B. Mishra,Y. Oh,B. Polsky,Z. Qin,S. Simeonov,S. Tian,X. Xu,W. Zhou,M. Zhu

DOI: https://doi.org/10.1109/iitc.2012.6251575

2012-01-01

Abstract:The reliability of complex interconnect structures at all levels of the chip integration hierarchy has become a major concern due to the use of fine feature sizes, diverse materials, and complex 3D architectures. Reliability issues range from stress related failures such as dielectric cracking and interface debonding during manufacturing to electrical and mechanical failures such as electromigration and void formation during operation. This paper summarizes computational results obtained using a unified physics-based 3D simulation framework.
Reliability of MEMS inertial devices in mechanical and thermal environments: A review

Yingyu Xu,Shuibin Liu,Chunhua He,Heng Wu,Lianglun Cheng,Guizhen Yan,Qinwen Huang

DOI: https://doi.org/10.1016/j.heliyon.2024.e27481

IF: 3.776

2024-03-03

Heliyon

Abstract:The reliability of MEMS inertial devices applied in complex environments involves interdisciplinary fields, such as structural mechanics, material mechanics and multi-physics field coupling. Nowadays, MEMS inertial devices are widely used in the fields of automotive industry, consumer electronics, aerospace and missile guidance, and a variety of reliability issues induced by complex environments arise subsequently. Hence, reliability analysis and design of MEMS inertial devices are becoming increasingly significant. Since the reliability issues of MEMS inertial devices are mainly caused by complex mechanical and thermal environments with intricate failure mechanisms, there are fewer reviews of related research in this field. Therefore, this paper provides an extensive review of the research on the reliability of typical failure modes and mechanisms in MEMS inertial devices under high temperature, temperature cycling, vibration, shock, and multi-physical field coupling environments in the last five to six years. It is found that though multiple studies exist examining the reliability of MEMS inertial devices under single stress, there is a dearth of research conducted under composite stress and a lack of systematic investigation. Through analyzing and summarizing the current research progress in reliability design, it is concluded that multi-physical field coupling simulation, theoretical modeling, composite stress experiments, and special test standards are important directions for future reliability research on MEMS inertial devices.
A reliability investigation of MEMS transducers with comb structures

Ping An,Yandong He,Yufeng Jin,Yi Long Hao

DOI: https://doi.org/10.1109/ICEPT.2008.4607044

2008-01-01

Abstract:An overview of reliability investigation of micro electro mechanical system (MEMS) transducers with comb structures was presented. With the development of the MEMS industrialization, the reliability is underway to meet the need of market. To build a reliability research and develop platform, MEMS center of Peking University made its roadmap of a general developing plan. In this paper, the roadmap was presented and the short-term roadmap about failure analysis (FA) was illustrated. In addition, FA techniques of localization, characterization and sample preparation for MEMS were summarized. Finally, some FA cases of the center of PKU were discussed and a destructive physical analysis (DPA) case about the particle impact noise detection (PIND) was presented.
Research on Microelectron-Mechanical System and Its Application

Shi-xiang Jiang,Shi-qiang ZHU,Wen-sheng Huang

2001-01-01

Abstract:Theoretical and technical basis of MEMS are introduced.Future application of microelectron-machine to space,medicine,national defense and industries are listed in this paper.
A novel multi-direction high shock reliability test on MEMS devices

Wenzhong LOU,Renlong SONG,Yunjian Liu,Xiaosong Liu,Weihua Li,Wanfeng Lin

DOI: https://doi.org/10.1109/NEMS.2009.5068573

2009-01-01

Abstract:Most MEMS/NEMS devices are working on the harsh environment, such as high shock and temperature environment, ranging from aerospace science, automobile industry, mechanical engineering, to medical and safety engineering. The reliability of MEMS/NEMS devices is the most important issue today. MEMS devices must perform their required functions for the duration of the equipment's requirement profile. However, there is a need to implement standardized tests and requirements to ensure the performance of MEMS devices in fielded and emerging military systems. This paper presents the multi-direction high shock environment for MEMS devices, and introduces a dynamic test and shock response spectra (SRS) testing technology. The simulation test of shock environment based equivalent injury theory is studied. A computation program is written in software-Matlab with the modified digital filtering algorithm. The SRS of the shock signal of dispersing is calculated. Also, the simulation of the SRS of dispersing is probed into by using drop test.
Microelectromechanical System Technology and Its Application

张海涛,张斌

DOI: https://doi.org/10.3969/j.issn.1001-2028.2002.04.010

2002-01-01

Abstract:Microelectromechanical system (MEMS) technology makes it possible the moralization and integration of the products based on the material of silicon. This technology is divided into four categories: body, surface, metal and compound micromechanical processes. The basic technologies included in the micromechanical system are erosion, si-bond, multiplayer film sediment without stress, sacrifice layer, LIGA and the combined technologies based on them. The applications of micro-sensors, micro-machines, mechanism filter and resonant filters are presented, and the further development of technology is discussed.
Materials issues in microelectromechanical devices: science, engineering, manufacturability and reliability

A.D Romig,Michael T Dugger,Paul J McWhorter

DOI: https://doi.org/10.1016/s1359-6454(03)00440-3

IF: 9.4

2003-11-01

Acta Materialia

Abstract:MicroElectroMechanical Systems (MEMS) technology offers considerable potential throughout the manufacturing sector, because of certain intrinsic advantages in terms of low cost, reliability, and small size. Relatively simple MEMS are used in applications ranging from automobile air bag sensors to electronic games. Considerably more complex devices have been designed for defense applications, for which government funding is available; however, the fledgling industry suffers from insufficient knowledge of materials physics at micrometer size and from the fact that currently commercialized MEMS devices are designed for specialized and rather disparate purposes, do not have a broad user base, and therefore have not generated industry standards or the design and process software that would be built upon those industry standards. In addition to industry standards, further advances in MEMS technology require a more complete understanding of the physics underlying performance and reliability. The first half of this paper reviews general issues related to fabrication and commercialization; the second half addresses the technical materials issues that relate to MEMS performance and reliability.

materials science, multidisciplinary,metallurgy & metallurgical engineering
RESEARCH ON SEVERAL MECHANICAL PROBLEMS IN MICROELECTROMECHANICAL SYSTEMS

张向军,孟永钢,温诗铸

DOI: https://doi.org/10.3969/j.issn.1000-0879.2003.02.002

2003-01-01

Abstract:This paper reviews the state-of-the-art of researches on several solid mechanics problems in Micro-electromechanical Systems (MEMS), including the basic mechanical properties of materials, mechanical analysis of microstructures, failure analysis of microsystems and actuating mechanisms of microsystems. Different kinds of acting forces, multi-factor interactions, multi-disciplinary nature and non-linearity due to the scaling effect and surface effect are emphasized, and the future work in this field is suggested.
Evaluation of Residual Stress in MEMS Micromirror Die Surface Mounting Process and Shock Destructive Reliability Test

Xiao-Yong Fang,Chun-Cheng Liu,Xiu-Yuan Li,Jia-Hao Wu,Kai-Ming Hu,Wen-Ming Zhang

DOI: https://doi.org/10.1109/jsen.2023.3283511

IF: 4.3

2023-01-01

IEEE Sensors Journal

Abstract:Light detection and ranging (LiDAR) devices based on micro-electromechanical systems (MEMS) micromirrors have been promising sensors for automatic driving due to the advantages of MEMS devices. The packaging plays a vital role in the reliability of MEMS micromirror but introduces the residual stress from the surface mounting process. The shock reliability of micromirrors is influenced by residual stress. In this work, the residual stress from the surface mounting process is investigated through resonant frequency tests. The frequency drift can be 718 and −281 Hz under the residual stress of 107.0 and −25.0 MPa, respectively. As the difference of coefficient of thermal expansion (CTE) rises, the residual stress proportionally increases but decreases with the thickness of the substrate. In addition, a higher curing temperature can introduce a more significant stress level. The dynamic response in a shock environment under different residual stress is analyzed. Drop fall experiments verify the theoretical conclusions that the stiffness hardening effect can improve the shock level tolerance. The tensile stress levels of 41.7 and 107.0 MPa are corresponding to 100 and 200 g, respectively. The influences of residual stress on frequency drift and reliability need to be considered seriously and simultaneously during the packaging design for MEMS micromirrors. This work provides a deep insight into the commercial applications of MEMS-based LiDAR in autonomous driving.

engineering, electrical & electronic,instruments & instrumentation,physics, applied
Destructive Reliability Analysis of Electromagnetic MEMS Micromirror Under Vibration Environment

Xiao-Yong Fang,Xiu-Yuan Li,Kai-Ming Hu,Ge Yan,Jia-Hao Wu,Wen-Ming Zhang

DOI: https://doi.org/10.1109/jstqe.2021.3124140

IF: 4.9

2022-09-01

IEEE Journal of Selected Topics in Quantum Electronics

Abstract:Micro-Electro-Mechanical Systems (MEMS) micro-mirrors have shown great potential in consumer applications, such as Light Detection and Ranging (LiDAR) devices and portable laser projectors. The LiDAR based on electromagnetic MEMS micro-mirror is usually exposed to vibration loads for autonomous vehicles, which results in the necessity for the destructive reliability assessment of micromirrors under vibration environment, but such studies are rarely reported. This paper explores the destructive reliability of electromagnetic MEMS micromirror under vibration environment according to the JESD22-B103B standard. The reliability evaluation is conducted by experimental tests, finite element stress analysis and theoretical dynamic response analysis. Micromirrors are tested under sweep excitation, and they are failed with the vibration level of around 33 g. The failure and stress analysis demonstrate that the crack fracture is located at the root of the slow axis. The nonlinear relationship between the peak displacement of the balance frame and acceleration levels is investigated through theoretical analysis. The nonlinearity of stiffness hardening is induced by the axial tensile strain of the beam, which contributes to the displacement-reduction of the gimbal. This work provides some valuable suggestions for the optimization design of MEMS micromirrors to improve the acceleration tolerance level in vibration environment.

engineering, electrical & electronic,optics,physics, applied,quantum science & technology
Advanced packaging technology for MEMS

王海宁,王水弟,蔡坚,贾松良

DOI: https://doi.org/10.3969/j.issn.1003-353X.2003.06.004

2003-01-01

Abstract:Some particularities for MEMS packaging:special signal interfaces, 3D-structureconfigurations, requirements of cases, passivation and reliability are summarized in this paper.Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced. The research and development of MEMSpackaging should be strengthened.
Research on Failure Diagnosis Method of a Rocket Borne Micro Electro-Mechanical Systems Recorder Based on Fault Tree

Ming-xing Yang,Lin Dang,Tao Wen

DOI: https://doi.org/10.1166/jno.2022.3293

2022-06-01

Journal of Nanoelectronics and Optoelectronics

Abstract:With the complexity and diversification of rocket launch tasks, more stringent requirements are put forward for MEMS electronic equipment, which is closely related to the stability and security of rocket. The key components of the rocket-borne electronic system are composed of discrete components, integrated components and corresponding connected fixed components. The selection, welding and board level connection of each electronic element determine the reliability of the MEMS component. In this paper, the fault tree analysis method is applied to the reliability analysis of the rocket-borne recorder, and the dynamic fault tree analysis method is introduced to compensate the deficiency of the traditional static fault tree analysis method, finally the simulation comparison with Monte-Carlo analysis method is carried out to verify the effectiveness and feasibility of the proposed method. The work of this paper is of great significance for establishing the reliability theory of the system and mastering the experience of quick failure diagnosis.

engineering, electrical & electronic,nanoscience & nanotechnology,physics, applied
Novel MEMS Devices for Information Systems

Ren Tian-Ling

DOI: https://doi.org/10.1109/aprasc.2004.1422379

2004-01-01

Abstract:MEMS are paid more and more attention in the present information society. With the development of modern information technologies, information systems are becoming more compact, miniature and smart. MEMS devices and systems fit this trend well. The development and properties of MEMS technologies are reviewed. MEMS technologies are based on the technical inter-growing of microelectronics, materials science, mechanics, physics, chemistry, radio science, etc, and they have developed very fast from the very beginning. MEMS technologies are very promising for a wide range of information system applications. Some typical application examples are given.
DETERMINATION OF MECHANICAL BEHAVIOR OF MEMS MATERIALS

T. Zhong

Abstract:In recent years, there has been explosive growth in the field of the micro-electro-mechanical system (MEMS). MEMS technologies have been found wide application in various microscale systems and devices. With the increase of usage of MEMS, higher reliability of the MEMS devices under the thermal, electric and magnetic forces are required. So the mechanical properties of the MEMS materials become more and more important. The testing methods on mechanical properties of the MEMS materials are reviewed with the discussion of both the advantages and the disadvantages, such as the nanoindentation test, the membrane bulge test, the beam bending test, the micro-Raman Spectroscopy and the uniaxial tension method. And the new developments of them are introduced simply. Some research works of the authors on the uniaxial tension method are introduced, including the details of the specimen and the grip design, the loading and the strain measurement. The finite element method was used to simulate the tension test of the samples with different shape parameters to choose the shape and dimensions of the specimen. And the interference strain /displacement gauge (interference strain /displacement gauge, ISDG) was used to measure the stain. By using the self-developed uniaxial tension testing device, the stress-strain curves of the polycrystalline copper thin film are obtained successfully.

Engineering,Materials Science
Study Of A Micro Electromagnetic Relay Based On Mems

Yf Zhang,Ds Li,Jw Sun

2001-01-01

Abstract:This paper presents a novel micro electromagnetic relay based on MEMS technology. The micro relay includes some characteristics such as small volume, rapid response and longevity, moreover, it takes performances between the common electromagnetic relay and the solid-state one. The author proposes a few special researches found on this kind of relay in this paper. At first the working theory and the design concerned with the micro relay are explained in brief. Then the fabrication process of the relay is expatiated in detail. At last we have a simulation analysis for the relay by using ANSYS, and provide some beneficial properties with the simulation results.
TECHNOLOGY OF SILICON-BASED MEMS

郝一龙,张大成,李婷

DOI: https://doi.org/10.3969/j.issn.1671-7449.2002.z2.032

2001-01-01

Abstract:Concerning the development history of MEMS technology, the present paper introduces a state of the art developing direction of silicon based MEMS machining, indicating that there are two main developing directions. One is sacrificial layers technology, and the other is bulk micromachining. Sacrificial layers technology is developing towards multiple layers and integration. Bulk micromachining mainly includes combination of bonding and deep etching, pursuit to big mass and small stress, and three dimensional fabrications technology which is the developing direction of new body silicon technology. Standard process fabrication is becoming more and more important for MEMS study.
Study on New Method of MEMS Monolithic Integration and Its Key Technology

王晓红,谭智敏,刘理天,李志坚

2001-01-01

Abstract:A new method for MEMS monolithic integration-post micromachining technique compatible with IC standard technology is presented. The key related techinques are studied:integrated circuits protection technique by SiC deposited by PECVD and porous silicon sacrifitial layer technique. The experimental research of porous silicon sacrificial layer technique has been carried out and good results obtained.

Reliability Technology of MEMS

MEMS Reliability Review

Research Status of Macro-Modeling of MEMS Devices for Systems Level Simulations

Reliability of MEMS: A perspective on failure mechanisms, improvement solutions and best practices at development level

Computational Analysis of Mechanical and Electromigration Reliability Problems

Reliability of MEMS inertial devices in mechanical and thermal environments: A review

A reliability investigation of MEMS transducers with comb structures

Research on Microelectron-Mechanical System and Its Application

A novel multi-direction high shock reliability test on MEMS devices

Microelectromechanical System Technology and Its Application

Materials issues in microelectromechanical devices: science, engineering, manufacturability and reliability

RESEARCH ON SEVERAL MECHANICAL PROBLEMS IN MICROELECTROMECHANICAL SYSTEMS

Evaluation of Residual Stress in MEMS Micromirror Die Surface Mounting Process and Shock Destructive Reliability Test

Destructive Reliability Analysis of Electromagnetic MEMS Micromirror Under Vibration Environment

Advanced packaging technology for MEMS

Research on Failure Diagnosis Method of a Rocket Borne Micro Electro-Mechanical Systems Recorder Based on Fault Tree

Novel MEMS Devices for Information Systems

DETERMINATION OF MECHANICAL BEHAVIOR OF MEMS MATERIALS

Study Of A Micro Electromagnetic Relay Based On Mems

TECHNOLOGY OF SILICON-BASED MEMS

Study on New Method of MEMS Monolithic Integration and Its Key Technology