Plasma Cleaning and Its Application in Microelectronics Packaging

聂磊,蔡坚,贾松良,王水弟
DOI: https://doi.org/10.3969/j.issn.1003-353x.2004.12.011
2004-01-01
Abstract:Wet cleaning process is getting more and more limitated in the development of themicroelectronic industry. Dry cleaning methods would be the solutions for the environment pollu-tion caused by wet cleaning. The productivity of dry cleaning is improved as well. Plasma cleaninghas more obvious advantages than other processes. The mechanism, types, process characteristicand the applications of plasma cleaning in microelectronics packaging are presented.
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