The Present Situation and Progress of Moderate Temperature Curing Epoxy Resin

谢瑞广,丘哲明,王斌,薛宁娟
DOI: https://doi.org/10.3969/j.issn.1001-0017.2003.05.013
2003-01-01
Abstract:In this paper, the Present situation and the recent progress of latent moderate temperature curing epoxy resin system were introduced, especially the progress of dicyandiamide/epoxy resin system, imidazole/epoxy resin system, and acid anhydride/epoxy resin system. The promoters for the curing systems are also introduced and the development and the progress are prospected.
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