Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide

Feng Wu,Xingping Zhou,Xinhai Yu

DOI: https://doi.org/10.1039/c7ra13233f

IF: 4.036

2018-01-01

RSC Advances

Abstract:The curing mechanism of the TGDDM/DICY system consisted of two main reactions and it experienced two autocatalytic curing processes.

chemistry, multidisciplinary

What problem does this paper attempt to address?

Branched 1,6-Diaminohexane-derived Aliphatic Polyamine As Curing Agent for Epoxy: Isothermal Cure, Network Structure, and Mechanical Properties

Jintao Wan,Cheng Li,Hong Fang,Bo-Geng Li

DOI: https://doi.org/10.1021/acs.iecr.7b00610

2017-01-01

Industrial & Engineering Chemistry Research

Abstract:Aliphatic diamines and polyamines are long used as important airing agents for epoxy resins, especially in room-temperature-cure epoxy coatings and adhesives due to their high reactivity and low cost. Herein we systematically evaluate our newly developed liquid branched aliphatic polyamine, N,N,N',N'-tetra(3-aminopropyl)-1,6-diaminohexane (TADH), as the curing agent for bisphenol A epoxy (DGEBA), emphasizing the isothermal cure reaction, network structure, and mechanical properties. The isothermal curing reaction of DGEBA/TADH at 40, 50 60, and 70 degrees C is autocatalytic, and we adequately simulate the curing kinetic rate with the extended autocatalytic Kamal model. Further isoconversional kinetic analysis reveals that the effective activation energy changes dramatically as the reaction proceeds, especially for the diffusion-controlled stage due to the chemical vitrification (T-g infinity(DSC) = 119 degrees C). Compared to DGEBA/1,6-diaminohexane (a starting material of TADH), a dynamic mechanical analysis illustrates that the cured DGEBA/TADH network features three relaxations and shows the increased storage modulus (up to 54 degrees C), alpha and beta transition temperatures, and activation energy of the alpha relaxation. Also, DGEBA/TADH shows enhanced mechanical properties: flexural strength (similar to 95 MPa), flexural modulus (similar to 2440 MPa), and shear strength (similar to 8 MPa), with good processing ability (gel time of 130-150 min at 25 degrees C). Due to these merits, TADH may be suitable to be used in epoxy systems, highlighting its good promise in adhesive applications.
STUDY ON DGE-BHBTMBP/E-51/DDS CURED

Liang Jiyuan,Sun Jianzhong,Zhao Qian,Lin Yuteng,Zhou Qiyun

DOI: https://doi.org/10.3969/j.issn.1001-3539.2010.03.003

2010-01-01

Abstract:By using 4,4'-diaminodiphenylsulfone(DDS)as the curing agent,an epoxy resin based on diglycidyl ether of bisphenol A(epoxy resin E-51)was modified with a novel liquid-crystalline epoxy resin combining biphenyl and aromatic ester-type mesogenic units,diglycidyl ether of 4,4'-bis(4-hydroxybenzoyloxy)-3,3',5,5'-tetramethyl biphenyl(DGE-BHBTMBP).The influences of DGE-BHBTMBP on the thermal and mechanical properties of final cured resin systems were investigated by DMA,TGA and SEM.The results showed that DGE-BHBTMBP could increase the glass-transition temperature(Tg)and the initial temperature of decomposition(Td).Its Tg and Td increased 44℃ and 21.8℃ with 20% DGE-BHBTMBP,respectively.The curing system with 4% DGE-BHBTMBP had the good mechanical properties.The impact strength and the bending strength of the cured resin increase by 136% and 9%,respectively.
Studies on Cure Kinetics of Diglycidyl Ether of 4,4′-Bisphenol/4,4′-diaminobiphenyl Using the Advanced Isoconversional Method

Zhi-Qi Cai,Dong-Ming Qi,Jianzhong Sun,Hua Ren,Qian Zhao,Qiyun Zhou

DOI: https://doi.org/10.1080/03602550802391359

2008-01-01

Polymer-Plastics Technology and Engineering

Abstract:The cure kinetics of a rigid-rod epoxy monomer, diglycidyl ether of 4,4'-bisphenol (DGEBP), and the curing agent with the similar rigid-rod group, 4,4'-diaminebiphenyl (DABP), was studied using an advanced isoconversional method (AICM). DGEBP/DABP curing system was carried out by means of differential scanning calorimetry (DSC). Three exothermic peaks were depicted by nonisothermal DSC studies: the first two peaks were attributed to the curing reaction, and the last peak was attributed to the decomposition of the cured epoxy resin. The LC phase transformation of the curing process was observed by PLM. Using AICM, the largest activation energy of the curing reaction of DGEBP/DABP system was obtained as 108kJ/mol. It can also be learned that LC phase transformation of the curing process affects the reaction significantly.
Evaluating a Four-Directional Benzene-Centered Aliphatic Polyamine Curing Agent for Epoxy Resins

Jintao Wan,Cheng Li,Zhi-Yang Bu,Hong Fan,Bo-Geng Li

DOI: https://doi.org/10.1007/s10973-012-2863-8

IF: 4.755

2013-01-01

Journal of Thermal Analysis and Calorimetry

Abstract:A four-directional benzene-centered aliphatic polyamine, MXBDP, with high functionality and low volatility, is used to cure epoxy resin (DGEBA). Herein we originally report the isothermal cure kinetics and dynamic mechanical properties of DGEBA/MXBDP. Differential scanning calorimetry confirms that MXDBP is more reactive than commercial linear metaxylenediamine and branched Jeffamine T-403 and the isothermal curing reaction is autocatalytic. The Kamal model is found to be able to well describe the curing rate up to the onset of diffusion control, and the excellent match over the whole conversion range is achieved using the extended Kamal model. Interestingly, the isoconversional kinetic analysis indicates that the effective reaction activation energy (E α ) changes substantially with conversion, and ultimately decreases to a very small value (<10 kJ mol−1) because of the diffusion-controlled reaction kinetics. Then, dynamic mechanical analysis reveals that DGEBA/MXBDP exhibits the higher α- and β-relaxation temperatures and the much higher crosslink density than DGEBA/metaxylenediamine. Our experiment results support that MXBDP has the high reactivity and improved thermal resistance in combination with the advantages of the high functionality, low volatility and decreased CO2 absorption. Therefore, MXBDP may be especially suitable for room temperature-cure epoxy coatings and adhesives.
The Curing Behavior and Properties of Diglycidyl Ether of 4,4′-Bis(4-hydroxybenzoyloxy)-3,3′,5,5′-tetramethylbiphenyl and Its Composites with Multi-Wall Carbon Nanotubes

Jiyuan Liang,Jianzhong Sun,Qian Zhao,Yuteng Lin,Qiyun Zhou

DOI: https://doi.org/10.1080/03602559.2010.496404

2010-01-01

Polymer-Plastics Technology and Engineering

Abstract:The curing system of a liquid crystalline epoxy monomer, diglycidyl ether of 4,4′-bis(4-hydroxybenzoyloxy)-3,3′,5,5′-tetramethylbiphenyl (DGE-BHBTMBP), and curing agent diaminodiphenylsulfon (DDS) was investigated by means of differential scanning calorimetry (DSC). Physical properties of the cured polymer and its composites with carbon nanotubes were evaluated with dynamic mechanical thermal analysis (DMA). Test of transmission electron microscopy (TEM) showed that oxidated multi-wall carbon nanotubes (OX-MWNT) performed a better dispersion in the cured polymer than untreated MWNT did. The storage modulus of the cured polymer containing OX-MWNT increased, while that containing untreated MWNT decreased. The results also showed that the Tg decreased when the MWNT was filled.
Nonisothermal reaction kinetics of DGEBA with four-armed starlike polyamine with benzene core (MXBDP) as novel curing agent

Jintao Wan,Bo-Geng Li,Hong Fan,Zhi-Yang Bu,Cun-Jin Xu

DOI: https://doi.org/10.1016/j.tca.2010.06.021

IF: 3.5

2010-01-01

Thermochimica Acta

Abstract:A four-armed starlike polyamine with a benzene nucleus (MXBDP) was prepared, characterized, and employed as the novel curing agent for epoxy resin of bisphenol A (DGEBA). Nonisothermal reaction kinetics of DGEBA/MXBDP was systematically investigated using a differential scanning calorimeter (DSC) in terms of a model-fitting Málek approach and a model-free advanced isoconversional method of Vyazovkin (AICM). A two-parameter autocatalytic model of Šesták–Berggren (SB(m, n) model) was substantiated to be able to well describe the nonisothermal reaction rate of DGEBA/MXBDP. In addition, the correlation between effective activation energy Eα upon fractional conversion α was determined with the AICM. The result showed Eα dropped quickly at the initial stage of the reaction up to α≈10%, then showed a relative constant value of ≈57kJ/mol for α≈10–35%, and finally decreased again from ≈57 to ≈45kJ/mol until the completion, which implicates quite complex mechanisms of the reaction.
Nonisothermal Reaction, Thermal Stability and Dynamic Mechanical Properties of Epoxy System with Novel Nonlinear Multifunctional Polyamine Hardener

Jintao Wan,Bo-Geng Li,Hong Fan,Zhu-Yang Bu,Cun-Jin Xu

DOI: https://doi.org/10.1016/j.tca.2010.07.024

IF: 3.5

2010-01-01

Thermochimica Acta

Abstract:N,N,N′,N′-tetra(3-aminopropyl)-1,6-diaminohexane (TADH), a nonlinear multifunctional polyamine, was prepared and employed as a novel hardener for diglycidyl ether of bisphenol A (DGEBA). Nonisothermal reactions of DGEBA/TADH were systematically investigated with differential scanning calorimetry (DSC). According to the Málek method, the two-parameter Šesták–Berggren model was selected to simulate the reaction rate with a good match achieved, and a correlation of effective activation energies Eα with fractional conversion α was determined with the mode-free isoconversional Vyazovkin method. As α rose, Eα reduced quickly from ∼65 to 57kJ/mol up to α≈15%, then decreased slowly to ∼50kJ/mol till α≈75%, and finally dropped to ∼30kJ/mol at full conversion. In addition, analysis of thermal stability of the cured DGEBA/TADH with thermogravimetric analysis (TGA) revealed that it possessed quite good thermal stability and increased residual char content at 600°C in nitrogen. Furthermore, dynamic mechanical analysis (DMA) of the DGEBA/TADH network showed its relaxations were characterized by localized motions of hydroxyl ether segments (β relaxation) and cooperative motions of whole network chains (glass relaxation) at different temperature regions.
A Comparative Study of Epoxy Resin Cured with a Linear Diamine and a Branched Polyamine

Jintao Wan,Cheng Li,Zhi-Yang Bu,Cun-Jin Xu,Bo-Geng Li,Hong Fan

DOI: https://doi.org/10.1016/j.cej.2012.01.134

IF: 15.1

2012-01-01

Chemical Engineering Journal

Abstract:The molecular topology of amine curing agents is expected to greatly affect the curing reaction and properties of the epoxy resins, yet the exact influence still remains little understood. Herein we find out two representative aliphatic amines: linear propanediamine (PDA) and branched N,N,N′,N′-tetra(3-aminopropyl)-1,3-propanediamine (TAPA), and use them to cure diglycidyl ether of bisphenol A (DGEBA). The curing reaction, dynamic mechanical properties, and thermal stability of DGEBA/PDA and DGEBA/TAPA are systematically investigated and compared. Differential scanning calorimetry (DSC) confirms TAPA and PDA have very close reactivity much higher than that of commercial Jeffamine T-403 with the branched molecular structure. The curing kinetic analysis shows TAPA causes the higher isothermal conversion at the lower temperature (e.g., 40°C), the autocatalysis and diffusion-associated kinetics feature the isothermal reactions, and the extended Kamal model turns out to be able to well predict the curing rate. Then, the isoconversional analysis with the Vyazovkin methods demonstrates compared to PDA, TAPA leads to the lower effective activation energy at the very beginning due to its catalytic tertiary amino groups, but the reversed trend emerges in the deep-conversion stage, especially, in the glass-transition regime, owing to its flexible aliphatic molecular chains. Furthermore, the isothermal conversion at the higher temperatures is predicted from the nonisothermal experiments. Finally, dynamic mechanical analysis (DMA) shows cured DGEBA/TAPA exhibits the higher glass- and β-relaxation temperatures and crosslink density than DGEBA/PDA, and thermogravimetric analysis (TGA) reveals TAPA-cured epoxy has the excellent thermal stability with the higher char yield.
Synthesis and Curing of a Novel Combined Liquid Crystalline Epoxy

Zhi-qi CAI,Jian-zhong SUN,Hua REN,Qian ZHAO,Qi-yun ZIIOU,Jun-long XO

DOI: https://doi.org/10.3321/j.issn:1003-9015.2009.03.026

2009-01-01

Abstract:A novel combined liquid crystalline epoxy containing biphenyl and aromatic ester-type group, diglycidyl ether of 4, 4′-bis (4-hydroxybenzoyloxy)-3, 3′, 5, 5′-tetramethylbiphenyl (DGE-BHBTMBP), was synthesized. Its spectroscopic structure and thermal properties were investigated with NMR, differential scanning calorimetry (DSC) and polarized light microscopy (PLM). Two curing agents, diaminodiphenylsulfon (DDS) and bis (aminephenoxylphenyl) sulfone (BAPS), were chosen to investigate the curing behavior of epoxy/aromatic diamine by means of nonisothermal DSC. The curing results with these two curing agents show that BAPS is the more appropriate curing agent than DDS.
Cure Kinetics of an Epoxy Resin Containing Naphthyl/dicyclopentadiene Moieties and Bis‐phenoxy (3‐hydroxy) Phosphine Oxide System and Properties of Its Cured Polymer

Hua Ren,Jianzhong Sun,Qian Zhao,Cai Zhiqi,Qincai Ling,Qiyun Zhou

DOI: https://doi.org/10.1002/app.29491

IF: 3

2009-01-01

Journal of Applied Polymer Science

Abstract:The cure kinetics of naphthyl/dicyclopentadiene epoxy resin and bisphenoxy (3-hydroxy) phosphine oxide was investigated by differential scanning calorimetry (DSC) under nonisothermal and isothermal condition. The advanced isoconversional method was used to study the nonisothermal DSC data, the effective activation energy of the curing system in the early stage agreed with the value Calculated from the Kissinger model and then increased because of the hindrance of molecular mobility. Autocatalytic behavior was shown in the isothermal DSC measurement, which was well described by Kamal model in the early curing stage. In the later stage, a crosslinked network structure was formed and the curing reaction was mainly controlled by diffusion. The diffusion factor was introduced to optimize the Kamal model and correct the deviation of the calculated data. The physical properties of the cured polymer were evaluated by dynamic mechanical thermal analyses, were mogravimetric analyses, and limiting oxygen index test, which exhibited relatively high glass transition temperature, thermal stability, and flame retardancy. (C) 2009 Wiley Periodicals, Inc. J Appl Polym Sci 112: 761-768, 2009
Acrylonitrile-Capped Poly(Propyleneimine) Dendrimer Curing Agent for Epoxy Resins: Model-Free Isoconversional Curing Kinetics, Thermal Decomposition and Mechanical Properties

Jintao Wan,Cheng Li,Zhi-Yang Bu,Hong Fan,Bo-Geng Li

DOI: https://doi.org/10.1016/j.matchemphys.2012.11.060

IF: 4.778

2013-01-01

Materials Chemistry and Physics

Abstract:Acrylonitrile-modified aliphatic amine adducts are often used as curing agents for room-temperature epoxy formulations (coatings, adhesives, sealants, castings, etc.), yet the curing reaction and properties of resultant epoxy systems still remain less fundamentally understood. Herein we systematically investigate our newly-developed acrylonitrile-modified multifunctional polyamine curing agent for bisphenol A epoxy resin (DGEBA): an aciylonitrile-capped poly(propyleneimine) dendrimer (PAN4). The impact of the molecular structure of PAN4 and a controlled poly(propyleneimine) dendrimer (1.0GPPI) on the curing reactivity, reaction mechanisms, thermal stability, viscoelastic response and mechanical properties of the epoxy systems are highlighted. Differential scanning calorimetry (DSC) confirms DGEBA/PAN4 shows markedly lower reactivity and reaction exotherm than DGEBA/1.0GPPI, and the model-free isoconversional kinetic analysis reveals that DGEBA/PAN4 has the generally lower reaction activation energy. To be quantitative, the progress of the isothermal cure is predicted from the dynamic cure by using the Vyazovkin equation. The isothermal kinetic prediction shows that DGEBA/PAN4 requires about 10 times longer time to achieve the same conversion than DGEBA/1.0GPPI, which agrees with the experimentally observed much longer gel time of DGEBA/PAN4. Subsequently, dynamic mechanical analysis shows that PAN4 results in the cured epoxy network with the lower beta- and glass-relaxation temperatures, crosslink density, relaxation activation energy, enthalpy, entropy, but the higher damping near room temperature than 1.0GPPI. Finally, thermogravimetric analysis (TGA) demonstrates cured DGEBA/PAN4 is thermally stable up to 200 degrees C, and mechanical property tests substantiate that PAN4 endows the cured epoxy with much higher impact and adhesion strengths than 1.0GPPI. Our data can provide a deeper insight into acrylonitrile-modified aliphatic amine curing agents from the two good model compounds (PAN4 and 1.0GPPI). (C) 2012 Elsevier B.V. All rights reserved.
Model-Fitting and Model-Free Nonisothermal Curing Kinetics of Epoxy Resin with A Low-Volatile Five-Armed Starlike Aliphatic Polyamine

Jintao Wan,Zhi-Yang Bu,Cun-Jin Xu,Hong Fan,Bo-Geng Li

DOI: https://doi.org/10.1016/j.tca.2011.07.018

IF: 3.5

2011-01-01

Thermochimica Acta

Abstract:This paper reports the original work on the nonisothermal curing reaction of bisphenol A epoxy resin (DGEBA) and N,N,N′,N′,N′′-penta(3-aminopropyl)-diethylenetriamine (PADT). The nonisothermal reaction kinetics of DGEBA/PADT is systematically investigated using dynamic DSC with the model-fitting and advanced model-free isoconversional methods. The high reaction heats (115–118kJ/mol) indicate that PADT can efficiently cure DGEBA, and the reaction activation energy is 55.4kJ/mol. The further reaction kinetic analysis with the Málek method discloses the autocatalytic characteristic, and the Šesták–Berggren model is able to well simulate the reaction rate. Furthermore, the dependence of the effective activation energy on conversion is established from the model-free kinetic analysis with the Vyazovkin method, from which the reaction mechanisms are discussed in detail. Additionally, the isothermal conversion predication from the nonisothermal data is accomplished using the two methods, respectively, with an acceptable match obtained.
Preparation, Curing Kinetics, and Properties of a Novel Low-Volatile Starlike Aliphatic-Polyamine Curing Agent for Epoxy Resins

Jintao Wan,Zhi-Yang Bu,Cun-Jin Xu,Bo-Geng Li,Hong Fan

DOI: https://doi.org/10.1016/j.cej.2011.04.004

IF: 15.1

2011-01-01

Chemical Engineering Journal

Abstract:A novel low-volatile starlike aliphatic polyamine with extraordinarily high –NH2 functionalities, N,N,N′,N′,N′′-penta(3-aminopropyl)-diethylenetriamine (PADT), is synthesized and its molecular structure is confirmed by the FTIR, 1H NMR and ESI-MS analysis. Then PADT is employed as the curing agent for the epoxy resin of diglycidyl ether of bisphenol A (DGEBA) and the isothermal reaction of DGEBA/PADT is systematically investigated with differential scanning calorimetry (DSC) according to the model-fitting approach and model-free advanced isoconversional method developed by Vyazovkin. The result shows that PADT possesses the high reactivity and the reaction is autocatalytic in nature. The further reaction kinetic analysis indicates that the Kamal model can well fit the reaction rate at the reaction-controlled stage, whereas the extended Kamal model with a diffusion term can provide an excellent match throughout the isothermal reaction. On the other hand, the model-free kinetic analysis reveals a strong dependence of effective activation energy, Eα, on fractional conversion, α, which could mirror the drastic change of the reaction mechanisms, in particular, the rapid drop in Eα observed in the deep-conversion regime due to the diffusion-controlled reaction kinetics. Then, a dynamic mechanical analysis (DMA) of the cured DGEBA/PADT network discloses three relaxations from the low- to high-temperature range: β (Tβ=−34.4°C), α′ (Tα′=68.0°C) and α (Tg=144.3°C). Moreover, compared to linear propanediamine, PADT can much increase the crosslink density and glass temperature of the cured epoxy resin. Finally, the thermogravimetric (TG) analysis reveals PADT, like propanediamine, can impart the cured epoxy resin with the excellent thermal stability with the initial decomposition temperature as high as ∼300°C. On the basis of these experimental data, we can conclude that PADT exhibits a great potential to partially replace conventional high-volatile aliphatic-amine curing agents of low molecular weights.
Learning about novel amine-adduct curing agents for epoxy resins: Butyl-glycidylether-modified poly(propyleneimine) dendrimers

Jintao Wan,Zhi-Yang Bu,Cun-Jin Xu,Bo-Geng Li,Hong Fan

DOI: https://doi.org/10.1016/j.tca.2011.02.038

IF: 3.5

2011-01-01

Thermochimica Acta

Abstract:Novel butyl-glycidylether-modified poly(propyleneimine) dendrimers (PPIs) are prepared by reacting butyl glycidylether with PPI, which turn out to be able to cure bisphenol-A epoxy resin to an acceptable reaction extent. The nonisothermal reactions, dynamic mechanical properties and thermal stabilities of their cured epoxy resin are comparatively investigated with DSC, DMA and TGA, respectively. The model-fitting kinetic study demonstrates that Šesták–Berggren model can generally well simulate the reaction rates, and the isoconversional kinetic analysis with the Vyazovkin method indicates the curing agents, particularly their setric hindrance and the number of the –OH groups attached, greatly affect reaction kinetic schemes. Increasing the number of the BGE substituents attached to PPIs decreases the reactivity, glass- and beta-relaxation temperatures and thermal stability of the resulting epoxy systems, yet the intensity and width of the glass relaxation increase. This work offers a unique way of preparing modified-aliphatic-polyamine curing agents, and provides an opportunity to better learn about the amine-adduct curing agents which are widely used in room-temperature-cure epoxy coatings and adhesives from these good model compounds.
Curing Behavior and Thermal Properties of Trifunctional Epoxy Resin Cured by 4,4′‐Diaminodiphenylmethane

Cheng Jue,Li Juan,Yang Wantai

DOI: https://doi.org/10.1002/app.30630

IF: 3

2009-01-01

Journal of Applied Polymer Science

Abstract:A novel trifunctional epoxy resin (TMBPBTH-EPOXY) was synthesized in our laboratory, and its curing behavior and performance were studied by curing with 4,4'-diaminodiphenylmethane (DDM) with the mass ratio of 30 : 100 of TMBPBTH-EPOXY and DDM. The mixtures of TMBPBTH-EPOXY/DDM were cured at 100, 140, and 160 degrees C, respectively. The curing state was kept for different time from I to 6 h. The transition reaction of epoxide group during curing process was monitored by Fourier transform infrared spectroscopy. It was found that curing reaction was both dependent on the curing temperature and curing time, and the curing temperature has more effect on the curing reaction than the curing time. The curing activation energy was investigated by differential scanning calorimetry to be 55.13 and 55.10 kJ/mol. The glass transition temperature of TMBPBTH-EPOXY/DDM system was 240.2 degrees C. The thermal decomposition temperature at different temperatures and time were studied by thermogravimetric analyzer. (C) 2009 Wiley Periodicals, Inc. J Appl Polym Sci 114: 1976-1983, 2009
Curing Behaviour of Epoxy Resin with a Diamine Containing Heterocyclic Rings

X. D. Lu,Y. D. Huang,C. H. Zhang

DOI: https://doi.org/10.1177/096739110701500606

2007-01-01

Polymers and Polymer Composites

Abstract:The curing behaviour of a new epoxy curing agent, 2, 6-di (p-aminophenyl) benzo[1.2.5.4] bisoxazole (DIABO) was discussed. Diglycidyl-4, 5-epoxycyclohexane -1,2-dicarboxylate (TDE) was cured with a mixture of DIABO and diaminodiphenylsulfone (DDS). The aspects investigated including the curing procedure, reaction kinetics parameters and the heat resistance of the product. Average apparent activation energy of the resin's curing reaction was 63.55 kJ/mol, calculated according to the Kissinger and the Ozawa methods. The glass transition temperature was 261 °C and 257 °C determined by torsional braid analysis (TBA) and differential scanning calorimetry (DSC) respectively. The integral procedural decomposition temperature (IPDT) was 814 °C, respectively. Char residue was 44.58% at 572 °C. Compared to cure with TDE/DDS, these properties were improved by 18%, 8%, 30% and 50%, respectively.
Curing kinetics and properties of epoxy resin–fluorenyl diamine systems

Wenbin Liu,Qihao Qiu,Jun Wang,Zichun Huo,He Sun

DOI: https://doi.org/10.1016/j.polymer.2008.08.004

IF: 4.6

2008-01-01

Polymer

Abstract:Diglycidyl ether of bisphenol fluorene (DGEBF), 9,9-bis-(4-aminophenyl)-fluorene (BPF) and 9,9-bis-(3-methyl-4-aminophenyl)-fluorene (BMAPF) were synthesized to introduce more aromatic structures into the epoxy systems, and their chemical structures were characterized with FTIR, NMR and MS analyses. The curing kinetics of fluorenyl diamines with different epoxy resins including DGEBF, cycloaliphatic epoxy resin (TDE-85) and diglycidyl ether of bisphenol A (DGEBA) was investigated using non-isothermal differential scanning calorimetry (DSC), and determined by Kissinger, Ozawa and Crane methods. The thermal properties of obtained polymers were evaluated with dynamic mechanical thermal analysis (DMTA) and thermogravimetric analysis (TGA). The results show that the values of activation energy (Ea) are strongly dependent on the structures of epoxy resin and curing agent. The curing reactivity of epoxy system is restrained by the introduction of rigid fluorene into chain backbone and flexible methyl into side groups. The cured DGEBF/fluorenyl diamine systems exhibit remarkably higher glass transition temperature, better thermal stability and lower moisture absorption compared to those of DGEBA/fluorenyl diamine systems, and display approximate heat resistance and much better moisture resistance relative to those of TDE-85/fluorenyl diamine systems.
Synthesis, Characterization, and Properties of Low Viscosity Tetra-Functional Epoxy Resin N, N, N ', N '-Tetraglycidyl-3,3 '-Diethyl-4,4 '-Diaminodiphenylmethane

Fuqin Zheng,Xiaojuan Zhao,Xin Yang,Ying Zhang,Wei Huang

DOI: https://doi.org/10.1002/app.40009

IF: 3

2014-01-01

Journal of Applied Polymer Science

Abstract:ABSTRACTTetra‐functional epoxy resin N,N,N′,N′‐tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane (TGDEDDM) was synthesized and characterized. The viscosity of TGDEDDM at 25°C was 7.2 Pa·s, much lower than that of N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM). DSC analysis revealed that the reactivity of TGDEDDM with curing agent 4,4′‐diamino diphenylsulfone (DDS) was significantly lower than that of TGDDM. Owing to its lower viscosity and reactivity, TGDEDDM/DDS exhibited a much wider processing temperature window compared to TGDDM/DDS. Trifluoroborane ethylamine complex (BF3‐MEA) was used to promote the curing of TGDEDDM/DDS to achieve a full cure, and the thermal and mechanical properties of the cured TGDEDDM were investigated and compared with those of the cured TGDDM. It transpired that, due to the introduction of ethyl groups, the heat resistance and flexural strength were reduced, while the modulus was enhanced. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2014, 131, 40009.
Study of curing kinetics mechanism of DGEBF/DDS

NIU Hai-xia,ZHOU Tao,ZHANG Ai-min,LIU Shuai,REN Liu-bo

DOI: https://doi.org/10.3969/j.issn.1002-7432.2008.z1.002

2008-01-01

Abstract:The curing kinetics mechanism and reaction parameters of 9,9′bis[4-(2,3-epoxyproxy)phenyl]fluorene using 4,4′-diaminodiphenyl sulfone(DDS) as curing agent were investigated with a non-isothermal differential scanning calorimeter(DSC).The curing reaction mechanism and model were studied by in-situ infrared spectroscopy combined with moving-window two-dimensional(MW2D) correlation spectroscopy.The results showed that the apparent activation energy,diffusion factor and reaction order of curing reaction were 64.08 kJ/mol,3.80×104 s-1 and 1.55 respectivly.The curing process was determinated as being 150 ℃/1.5 h+190 ℃/2 h+220 ℃/1.5 h.The curing mode was auto-catalyze reaction forming branch-like reaction center.The curing mechanism was an epoxy group reacted with a primary amine containing a hydroxyl group and a secondary amine,then a secondary amine reacted with another epoxy group and formed a tertiary amine and a hydroxyl group.The two reactions were independent and a hydroxyl group reacted with an epoxy group to form a hydroxyl group at high temperature,then the curing crossing networks formed gradually.
Reaction Kinetics, Thermal Properties of Tetramethyl Biphenyl Epoxy Resin Cured with Aromatic Diamine

Tiezhu Fu,Gang Zhang,Shuangling Zhong,Chengji Zhao,Ke Shao,Lifeng Wang,Hui Na

DOI: https://doi.org/10.1002/app.26340

IF: 3

2007-01-01

Journal of Applied Polymer Science

Abstract:Epoxy resins, 4, 4 '-diglycidyl (3, 3 ', 5, 5 '-tetra-methylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and cliglycidyl ether of bisphenol-A epoxy resin (DGEBA) cured with p-phenylenediamine (PDA) was performed by differential scanning calorimeter using an isoconversional method with dynamic conditions. The effect of the molar ratios of TMBP to PDA on the cure reaction kinetics was studied. The results showed that the curing of epoxy resins contains different stages. The activation energy was dependent of the degree of conversion. At the early of curing stages, the activation energy showed the activation energy took as maximum value. The effects of rigid rod groups and molar ratios of TMBP to PDA for the thermal properties were investigated by the DSC, DMA and TGA. The cured 2/1 TMBP/PDA system with rigid rod groups and high crosslink density had shown highest T-g and thermal degradation temperature. (c) 2007 Wiley Periodicals, Inc.

Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide

Branched 1,6-Diaminohexane-derived Aliphatic Polyamine As Curing Agent for Epoxy: Isothermal Cure, Network Structure, and Mechanical Properties

STUDY ON DGE-BHBTMBP/E-51/DDS CURED

Studies on Cure Kinetics of Diglycidyl Ether of 4,4′-Bisphenol/4,4′-diaminobiphenyl Using the Advanced Isoconversional Method

Evaluating a Four-Directional Benzene-Centered Aliphatic Polyamine Curing Agent for Epoxy Resins

The Curing Behavior and Properties of Diglycidyl Ether of 4,4′-Bis(4-hydroxybenzoyloxy)-3,3′,5,5′-tetramethylbiphenyl and Its Composites with Multi-Wall Carbon Nanotubes

Nonisothermal reaction kinetics of DGEBA with four-armed starlike polyamine with benzene core (MXBDP) as novel curing agent

Nonisothermal Reaction, Thermal Stability and Dynamic Mechanical Properties of Epoxy System with Novel Nonlinear Multifunctional Polyamine Hardener

A Comparative Study of Epoxy Resin Cured with a Linear Diamine and a Branched Polyamine

Synthesis and Curing of a Novel Combined Liquid Crystalline Epoxy

Cure Kinetics of an Epoxy Resin Containing Naphthyl/dicyclopentadiene Moieties and Bis‐phenoxy (3‐hydroxy) Phosphine Oxide System and Properties of Its Cured Polymer

Acrylonitrile-Capped Poly(Propyleneimine) Dendrimer Curing Agent for Epoxy Resins: Model-Free Isoconversional Curing Kinetics, Thermal Decomposition and Mechanical Properties

Model-Fitting and Model-Free Nonisothermal Curing Kinetics of Epoxy Resin with A Low-Volatile Five-Armed Starlike Aliphatic Polyamine

Preparation, Curing Kinetics, and Properties of a Novel Low-Volatile Starlike Aliphatic-Polyamine Curing Agent for Epoxy Resins

Learning about novel amine-adduct curing agents for epoxy resins: Butyl-glycidylether-modified poly(propyleneimine) dendrimers

Curing Behavior and Thermal Properties of Trifunctional Epoxy Resin Cured by 4,4′‐Diaminodiphenylmethane

Curing Behaviour of Epoxy Resin with a Diamine Containing Heterocyclic Rings

Curing kinetics and properties of epoxy resin–fluorenyl diamine systems

Synthesis, Characterization, and Properties of Low Viscosity Tetra-Functional Epoxy Resin N, N, N ', N '-Tetraglycidyl-3,3 '-Diethyl-4,4 '-Diaminodiphenylmethane

Study of curing kinetics mechanism of DGEBF/DDS

Reaction Kinetics, Thermal Properties of Tetramethyl Biphenyl Epoxy Resin Cured with Aromatic Diamine