Study of curing kinetics mechanism of DGEBF/DDS

NIU Hai-xia,ZHOU Tao,ZHANG Ai-min,LIU Shuai,REN Liu-bo
DOI: https://doi.org/10.3969/j.issn.1002-7432.2008.z1.002
2008-01-01
Abstract:The curing kinetics mechanism and reaction parameters of 9,9′bis[4-(2,3-epoxyproxy)phenyl]fluorene using 4,4′-diaminodiphenyl sulfone(DDS) as curing agent were investigated with a non-isothermal differential scanning calorimeter(DSC).The curing reaction mechanism and model were studied by in-situ infrared spectroscopy combined with moving-window two-dimensional(MW2D) correlation spectroscopy.The results showed that the apparent activation energy,diffusion factor and reaction order of curing reaction were 64.08 kJ/mol,3.80×104 s-1 and 1.55 respectivly.The curing process was determinated as being 150 ℃/1.5 h+190 ℃/2 h+220 ℃/1.5 h.The curing mode was auto-catalyze reaction forming branch-like reaction center.The curing mechanism was an epoxy group reacted with a primary amine containing a hydroxyl group and a secondary amine,then a secondary amine reacted with another epoxy group and formed a tertiary amine and a hydroxyl group.The two reactions were independent and a hydroxyl group reacted with an epoxy group to form a hydroxyl group at high temperature,then the curing crossing networks formed gradually.
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