Non-isothermal Curing Kinetics of Thermal Resistance Epoxy Resin Containing Fluorene

NIU Hai-xia,ZHOU Tao,ZHANG Ai-min,ZHANG Hui,TANG Guang-bin,REN Liu-bo

DOI: https://doi.org/10.3969/j.issn.1008-9357.2007.04.004

2007-01-01

Abstract:A kind of highly thermal-resistant epoxy resin 9,9'-bis([4-(2,3-epoxyproxy)phenyl]) fluorene was synthesized.The curing kinetics was investigated using 4,4'-diaminodiphenyl sulfone(DDS) as curing agent with a non-isothermal differential scanning calorimeter(DSC).The most(optimum) curing kinetic parameters were calculated using Flynn-Wall-Ozawa and Friedman methods,the curing mechanism function was proposed using curing kinetics simulation.The thermal resistant property was characterized by thermal gravity analysis(TGA).The results show: the apparent activation energy,diffusion factor and reaction order of curing reaction are founded to be 63.86 kJ/(mol,) 3.80×10~4 s~(-1) and 1.57.The curing mechanism is auto-catalyze reaction forming branch-like(reaction) center.The isothermal curing epoxy resin begin to decompose at 400 ℃,the char yield is(about) to be 41.7% at 700 ℃.