Power-aware High Level Evaluation Model of Interconnect Length of On-Chip Memory Network Topology

Xiao-Jun Wang,Feng Shi,Yi-Zhuo Wang,Hong Zhang,Xu Chen,Wen-Fei Fu
DOI: https://doi.org/10.1504/ijcse.2018.096030
2018-01-01
International Journal of Computational Science and Engineering
Abstract:Interconnect power is the factor that dominates the power consumption on the on-chip memory architecture. Almost all dedicated wires and buses are replaced with packet switching interconnection networks which have become the standard approach to on-chip interconnection. Unfortunately, rapid advances in technology are making it more difficult to assess the interconnect power consumption of NoC. To resolve this problem, a new evaluating methodology for interconnect power evaluation based on topology of on-chip memory (IP-ETOM) is proposed in this paper. To validate this method, two multicore architectures 2D-mesh and triplet-based architecture (TriBA) are evaluated in this research work. The on-chip memory network model is evaluated based on characteristics of on-chip architecture interconnection. MATLAB is used for conducting the experiment that evaluates the interconnection power of TriBA and 2D-mesh.
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