Flip-chip Integration of Tilted VCSELs Onto a Silicon Photonic Integrated Circuit

Huihui Lu,Jun Su Lee,Yan Zhao,Carmelo Scarcella,Paolo Cardile,Aidan Daly,Markus Ortsiefer,Lee Carroll,Peter O'Brien

DOI: https://doi.org/10.1364/oe.24.016258

IF: 3.8

2016-01-01

Optics Express

Abstract:In this article we describe a cost-effective approach for hybrid laser integration, in which vertical cavity surface emitting lasers (VCSELs) are passively-aligned and flip-chip bonded to a Si photonic integrated circuit (PIC), with a tilt-angle optimized for optical-insertion into standard grating-couplers. A tilt-angle of 10° is achieved by controlling the reflow of the solder ball deposition used for the electrical-contacting and mechanical-bonding of the VCSEL to the PIC. After flip-chip integration, the VCSEL-to-PIC insertion loss is -11.8 dB, indicating an excess coupling penalty of -5.9 dB, compared to Fibre-to-PIC coupling. Finite difference time domain simulations indicate that the penalty arises from the relatively poor match between the VCSEL mode and the grating-coupler.