Electronic-Photonic Integrated Circuit Design And Crosstalk Modeling For A High Density Multi-Lane Mzm Array

Pengfei Ji,Jing Gao,Wenyi Xu,Yanan Sun,Weifeng He,Hui Wu
DOI: https://doi.org/10.1109/ISCAS.2018.8351587
2018-01-01
Abstract:To meet the rapidly increasing bandwidth density demand in high-performance computers and data centers, the number of parallel lanes in a short-reach optical interconnect link is expected to increase by several folds. This paper presents a multi-lane traveling-wave Mach-Zehnder modulator (MZM) array design using silicon photonics technology. We treat the MZM as an electronic-photonic integrated circuit and adopt a newly developed multi-physics cross-layer design methodology. The design spans electrical/optical device modeling, electromagnetic simulation, and circuit analysis. The crosstalk issue within a closely-packed MZM array is investigated. The simulated 3-dB EO bandwidth of a single MZM is 17.5 GHz. The complete link considering crosstalk in the MZM array achieves BER< 1 x 10(-12) at 25 Gbps. A prototype chip with 4 MZMs is designed using IMEC 50G silicon photonics technology, saving significant chip area compared to conventional design.
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