Abstract:Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and high-bandwidth fabric for interconnect design. The advent of the 3D technology has provided further opportunity to reduce on-chip communication delay. However, the design of the 3D NoC topologies has important distinctions from 2D NoCs or off-chip interconnection networks. First, current 3D stacking technology allows only vertical inter-layer links. Hence, there cannot be direct connections between arbitrary nodes in different layers — the vertical connection topology are essentially fixed. Second, the 3D NoC is highly constrained by the complexity and power of routers and links. Hence, low-radix routers are preferred over high-radix routers for lower power and better heat dissipation. This implies long network latency due to high hop counts in network paths. In this paper, we design a low-diameter 3D network using low-radix routers. Our topology leverages long wires to connect remote intra-layer nodes. We take advantage of the start-of-the-art one-hop vertical communication design and utilize lateral long wires to shorten network paths. Effectively, we implement a small-to-medium sized clique network in different layers of a 3D chip. The resulting topology generates a diameter of 3-hop only network, using routers of the same radix as 3D mesh routers. The proposed network shows up to 29% of network latency reduction, up to 10% throughput improvement, and up to 24% energy reduction, when compared to a 3D mesh network.

A High-Throughput Network On-Chip in Full-Mesh Architecture

Firefly: Illuminating Future Network-On-Chip With Nanophotonics

A 2d Mesh Noc With Self-Configurable And Shared-Fifos Routers

Dual-link interconnect architecture for 3-D Mesh-based network on chip

A Dual-Port Access Structure of 3D Mesh-Based NoC

A Low-Cost and High-Throughput NoC-Aware Chip-to-Chip Interconnection

A Tightly Coupled Network-on-Chip Router Architecture

A Noc Centric Low Overhead Multi-chip Interconnection Technology.

A Dynamic and Low Latency Wireless NoC Architecture.

3-D Mesh-Based Optical Network-on-Chip for Multiprocessor System-on-Chip

Multi-mapping Meshes: A New Communicating Fabric for Networks-on-Chip

Design of a High-Throughput NoC Router with Neighbor Flow Regulation

UniMESH: the Light-Weight Unidirectional Channel Network-on-Chip in 2D Mesh Topology

A Low-Radix and Low-Diameter 3d Interconnection Network Design

Slim NoC: A Low-Diameter On-Chip Network Topology for High Energy Efficiency and Scalability

An Efficient and Low-Overhead Chip-to-Chip Interconnect Protocol Design for NOC

A High Performance Optical Network on Chip Based on Clos Topology

Self-optimizing Two-layer Network-on-Chip Based on Dominant Network-Flow Adaption

Dual-Link Hierarchical Cluster-Based Interconnect Architecture for 3D Network on Chip

High Throughput Memory Data-Path Design For Multi-Core Architecture

Design of an unbuffered switch for network on-chip