Abstract:In this dissertation, the relationships between structure-mechanical properties-deformation mechanisms in face-centered cubic (FCC) and body-centered cubic (BCC) metallic nanowires have been studied using in situ TEM nanomechanical testing. It is well known that smaller is stronger and the widely-observed size effect is believed to arise from dislocation interactions inside nanocrystals. However, the interaction mechanisms in small-volume nanocrystals remain unexplored. Here, it was found that surface-nucleated dislocations can strongly interact inside the confined volume of Au nanowires, which led to a new type of dislocation-originated stacking fault tetrahedra (SFT), at variance to the widely-believed vacancy-originated SFT. The atomic-scale processes of nucleation, migration and annihilation of dislocation-originated SFT were revealed, shedding new light onto the strain hardening and size effect in small-volume materials. Although nanoscale twinning is an effective mean to enhance the strength of metals, twin-size effect on the deformation and failure of nanotwinned metals remains largely unexplored, especially at the minimum twin size. Here, a new type of size effect in nanotwinned Au nanowires is presented. As twin size reaches the angstrom-scale, Au nanowires exhibit a remarkable ductile-to-brittle transition that is governed by the heterogeneous-to-homogeneous dislocation nucleation transition. Quantitative measurements show that approaching such a nanotwin size limit gives rise to the ultra-high strength in Au nanowires, close to the ideal strength limit of perfect Au. Twinning is a fundamental deformation mode that competes against dislocation slip in crystals. At the nanoscale, higher stresses are required for plastic deformation than that in bulk, which favors twinning over dislocation slip. Indeed, deformation twinning has been well-documented in FCC nanocrystals. However, it remains unexplored in BCC nanostructures. Here, it shows that twinning is the dominant deformation mode in BCC-tungsten nanocrystals. A competition between twinning and dislocation slip occurs when changing the loading orientations, attributed to the defect growth controlled plasticity in BCC nanocrystals. Several important commonalities and differences in FCC and BCC nanocrystals deforming at nanoscale are further proposed. The results from this dissertation advance fundamental understanding of plastic deformation in a broad class of metals and alloys, and are of technological importance for degradation control and future design of ultra-strength nanomaterials.

Investigation Of Scaling Effect Of Copper Microwire Based On In-Situ Nanorobotic Twisting Inside Sem

Scale effect investigation of copper microwire's mechanical properties after in situ scanning electron microscope twisting

In Situ TEM Study on the Nanomechanical Behaviors of Metallic Nanowires

In Situ Nanoscale Deformation Studies on Micro Copper Wires Using Atomic Force Microscopy

Simulating Size and Volume Fraction-Dependent Strength and Ductility of Nanotwinned Composite Copper

In Situ Nanomechanical Testing of Twinned Metals in a Transmission Electron Microscope

Mechanical Property of Metallic Nanowires: the Shorter is Stronger and Ductile

In Situ SEM Torsion Test of Metallic Glass Microwires Based on Micro Robotic Manipulation

In situ nanomechanical measurement of Cu nanowires

Deformation of Copper Nanowire under Coupled Tension–Torsion Loading

Nanorobotic System iTRo for Controllable 1D Micro/nano Material Twisting Test

Electromagnetic Properties of Metal Coated-Micro/nano Coils Fabricated by Self-deformation

Relating Residual Stress and Microstructure to Mechanical and Giant Magneto-Impedance Properties in Cold-Drawn Co-based Amorphous Microwires

In Situ Microwave Characterization Of Microwire Composites Under Mechanical Stress

In Situ Micromechanical Characterization of Metallic Glass Microwires under Torsional Loading

Simulation of Scale Dependency on Tensile Mechanical Properties of Single Crystal Copper Nano-Rod

In situ electron microscopy four-point electromechanical characterization of freestanding metallic and semiconducting nanowires

Design of a Novel Tensile Testing Device and Its Application in Tensile Testing Experiments on Copper Micro Wires

Nano-wire in-situ stretching device in scanning electron microscope and method therefor

Research on Fatigue Properties of Micron Scale Copper Bonding Wires

Nano lines in-situ stretching device in scanning electron microscope