Abstract:The continuous downward scaling in integrated circuit (IC) technologies has led to rapid shrinking of transistor and interconnect feature sizes. Scaling causes reduction in interconnect linewidth, which leads to surge in resistance due to increased contributions from grain boundary and surface scattering of electrons in the metal lines. Further, current density inside interconnects is also enhanced by the reduced linewidth and is approaching or exceeding the current-carrying capacity of the existing interconnect metals, copper (Cu) and tungsten (W). The resulting failure due to electromigration presents a critical challenge for end-of-roadmap IC technology nodes. Therefore, alternative materials such as nanocarbons and silicides are being investigated as potential replacements for Cu and W as they have superior electrical and mechanical properties in the nanoscale. In this review, the electrical properties of nanocarbons, in particular carbon nanotubes (CNTs), are examined and their performance and reliability in the sub-100 nm regime are assessed. Further, the measured properties are used to project 30 nm CNT via properties, which are compared with those of Cu and W.

Near-Field Radiated from Carbon Nanotube and Graphene-Based Nanointerconnects

Modeling of carbon nanotube (CNT) interconnects

Modeling of Carbon Nanotube Interconnects and Comparative Analysis with Cu Interconnects

Carbon‐Based Interconnects for RF Nanoelectronics

Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects

Crosstalk Prediction of Single- and Double-Walled Carbon-Nanotube (SWCNT/DWCNT) Bundle Interconnects

Comparative Study on Multilayer Graphene Nanoribbon (MLGNR) Interconnects

Analysis of Cu-Graphene Interconnects

Signal Integrity Analysis of Graphene Nano-Ribbon (GNR) Interconnects

Performance analysis of multi-walled carbon nanotube based interconnects

Recent Progress of Nano-Electromagnetic Compatibility (Nano-Emc) in the Emerging Carbon Nanoelectronics

High‐frequency Modeling of Cu‐graphene Heterogeneous Interconnects

Electrothermal Characterization of Single-Walled Carbon Nanotube (SWCNT) Interconnect Arrays

Electrothermal Cosimulation of 3-D Carbon-Based Heterogeneous Interconnects

Modeling and Characterization of Cu-Graphene Heterogeneous Interconnects

Circuit Modeling and Time Delay Analysis of Double-Walled Carbon Nanotube Interconnects

Nanocarbon via interconnects

Analysis of Signal Transmission along Graphene-Based Interconnect Structures

Prediction of crosstalk effects in future multiwall carbon nanotube (MWCNT) interconnects

Performance and Stability Analysis of Monolayer Single-Walled Carbon Nanotube Interconnects

Modeling of Crosstalk Effects in Multiwall Carbon Nanotube Interconnects