Covalently‐Bonded Laminar Assembly of Van der Waals Semiconductors with Polymers: Toward High‐Performance Flexible Devices

Ningxin Li,Tara Jabegu,Rui He,Seokjoon Yun,Sujoy Ghosh,Diren Maraba,Olugbenga Olunloyo,Hedi Ma,Aisha Okmi,Kai Xiao,Gangli Wang,Pei Dong,Sidong Lei

DOI: https://doi.org/10.1002/smll.202310175

IF: 13.3

2024-02-25

Small

Abstract:Enhancing interfacial adhesion in flexible devices is crucial for their stretchability and longevity. This study employs gold‐chalcogen bonding and mercapto silane bridges to reduce sliding and wrinkling issues. The improved fabrication workflow addresses soft lithography challenges to enhance the reliability of flexible microelectronics, making them more practical for applications in biomedical, environmental, and consumer electronics. Van der Waals semiconductors (vdWS) offer superior mechanical and electrical properties and are promising for flexible microelectronics when combined with polymer substrates. However, the self‐passivated vdWS surfaces and their weak adhesion to polymers tend to cause interfacial sliding and wrinkling, and thus, are still challenging the reliability of vdWS‐based flexible devices. Here, an effective covalent vdWS–polymer lamination method with high stretch tolerance and excellent electronic performance is reported. Using molybdenum disulfide (MoS2)and polydimethylsiloxane (PDMS) as a case study, gold–chalcogen bonding and mercapto silane bridges are leveraged. The resulting composite structures exhibit more uniform and stronger interfacial adhesion. This enhanced coupling also enables the observation of a theoretically predicted tension‐induced band structure transition in MoS2. Moreover, no obvious degradation in the devices' structural and electrical properties is identified after numerous mechanical cycle tests. This high‐quality lamination enhances the reliability of vdWS‐based flexible microelectronics, accelerating their practical applications in biomedical research and consumer electronics.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology

What problem does this paper attempt to address?

Covalently‐Bonded Laminar Assembly of Van der Waals Semiconductors with Polymers: Toward High‐Performance Flexible Devices

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