Abstract:The key control parameters in hot embossing (such as the imprint pressure, the imprint temperature, the holding time and the demolding temperature) can significantly impact on the pattern quality. The finite element method was used to analyze the embossing, cooling and demolding step to acquire the optimized process parameters. The simulation results show that the polymer flow has a reference to the imprint pressure, the imprint temperature and the holding time. While the adhesion force between the polymer and the mold can significantly influence the replication accuracy. Because of polymer flow, non-uniform pressure distribution can be observed and this results in the pattern height difference. The hydraulic pressure system was designed to acquire uniform pressure. Thermal stress caused by the difference of the thermal expansion coefficients between the mold and the polymer can induce stress concentration at the corner. If the demolding direction is not vertical to horizon, another stress concentration will appear. Excessive stress results in defects and causes fracture at the base part of the pattern during the demolding step. To eliminate the defects, cooling to a relative high temperature was introduced to reduce the stress concentration and an auto-demolding device was used to insure no additional stress was imported at the demolding step. The following experiment showed the successful fabrication of fine patterns with the optimized parameters.

Experimental and Numerical Study of Microchannel Formation in Rubber-Assisted Hot Embossing with an Open-Channel Mold

Study on Polymer Flow Profile in Micro Hot Embossing

Research on Optimization of the Hot Embossing Process

Flow Behavior of Polymer During Micro Hot Embossing

Rubber-assisted Embossing of Polymer Thin Films Using Molds with Through-Thickness Microchannels

Research on Modeling of Hot Embossing Polymeric Microfluidic Chip

Optimization of Control Parameters in Micro Hot Embossing

Numerical Simulation Of Hot Embossing For Polymer Microfluidic Chips

Experimental study on rubber-assisted embossing of micro fluidic chips

Defects in Micro Hot Embossing Process

Simulation Research on Stress of Polymeric Patterns During Micro Hot Embossing

Experimental Study on the Hot Embossing Polymer Microfluidic Chip

Research on Heat Transfer for Hot Embossing of Polymeric Microfluidic Chips

Hot embossing process analysis of microchannels for polymer microfluidic chips

Numerical Simulation of Mold Filling of Polymeric Materials with Friction Effect during Hot Embossing Process at Micro Scale

Finite Element Modeling of Polymer Flow During Hot Embossing with Different Mold Structures and Embossing Conditions

Study on Numerical Simulation of Thermal Viscoelastic Plastic Deformation Filling Mechanism in Micro-hot Embossing Process of Polymers

Simulation of Micro-embossing of Viscoelastic Polymer

Enhanced Polymer Filling and Uniform Shrinkage of Polymer and Mold in A Hot Embossing Process

Modeling of large area hot embossing

Impact of process parameters on the flow behavior and filling accuracy of photoresist in hot embossing for microgroove array