Atomistic kinetic Monte Carlo simulations of polycrystalline copper electrodeposition

Tanyakarn Treeratanaphitak,Mark D. Pritzker,Nasser Mohieddin Abukhdeir
DOI: https://doi.org/10.1016/j.elecom.2014.07.001
IF: 5.443
2014-09-01
Electrochemistry Communications
Abstract:A high-fidelity kinetic Monte Carlo (KMC) simulation method (T. Treeratanaphitak, M. Pritzker, N. M. Abukhdeir, Electrochim. Acta 121 (2014) 407–414) using the semi-empirical multi-body embedded-atom method (EAM) potential has been extended to model polycrystalline metal electrodeposition. Simulations using KMC-EAM are performed over a range of overpotentials to predict the effect on deposit texture evolution. Roughness–time power law behaviour (∝tβ) is observed where β=0.62±0.12, which is in good agreement with past experimental results. Furthermore, the simulations provide insights into the dynamics of sub-surface deposit morphology which are not directly accessible from experimental measurements.
electrochemistry
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