Systematic Experimental Study on Stitching Techniques of CMOS Image Sensors

Jun Zhu,Donghua Liu,Wei Zhang,Qing Wang,Wenliang Li,Lijun Chen,Chen Li,Yuhang Zhao
DOI: https://doi.org/10.1587/elex.13.20160441
2016-01-01
IEICE Electronics Express
Abstract:On the basis of the systematic study of stitching techniques, a large area, 28.3 mm x 38.8 mm, 42 Mega pixels CMOS Imaging Sensor (CIS) had been demonstrated on 12 inch silicon wafer in a 0.055 mu m CMOS process. By scanning a reticle across a wafer of silicon, smaller arrays can be stitched together to construct larger area sensors. Meanwhile, in order to verify the feasibility and capability of stitching, a 203 mm x 179 mm, 1.8 Billion pixels CIS was also created without any performance deficiency.
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