Optimization of Curing Behavior of Si3N4 UV Resin for Photopolymerization 3D Printing

Chuanru Cao,Zhe Zhao,Cao Wang
DOI: https://doi.org/10.1088/1757-899X/678/1/012013
2019-11-27
IOP Conference Series: Materials Science and Engineering
Abstract:Silicon nitride (Si3N4) ceramics are widely used in mechanical and thermal management applications due to their excellent properties. To overcome the difficulties in traditional Si3N4 ceramic forming techniques, it is interesting to see the possibility of making complex-shaped silicon nitride ceramic component with novel 3D printing methods. In this study, we aim to study the effect of photo-initiators on the curing behavior of pre-formulated Si3N4 ceramic UV resin suspension. To elucidate the potential multi-factor interactions, a statistic experiment design was implemented in a sequence of screening and optimization by using Modde software. It was found that the kinds of photo-initiators, total amount of initiators and the mixture ratio between initiators have a great influence on the curing properties of silicon nitride UV ceramic resin. Based on these results, a formula was selected based on the criterion of using least amount photo-initiator while reaching the highest curing thickness.
Engineering,Materials Science,Physics
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