Co-doping of InxGa1−xAs with silicon and tellurium for improved ultra-low contact resistance

J.J.M. Law,A.D. Carter,S. Lee,C.-Y. Huang,H. Lu,M.J.W. Rodwell,A.C. Gossard
DOI: https://doi.org/10.1016/j.jcrysgro.2012.12.122
IF: 1.8
2013-01-01
Journal of Crystal Growth
Abstract:We report Te doping of bulk In0.53Ga0.47As up to 2.6×1019cm−3 without saturation effects, and structural characterization and contact resistances between metal and epitaxial regrowth for four structures: Si doped and Si and Te co-doped n+ InAs regrowth on a 10nm In0.53Ga0.47As channel, Si doped and Si and Te co-doped n+ In0.53Ga0.47As regrowth on a 7nm In0.53Ga0.47As channel. We observe that the contact resistance for the Si doped and Si and Te co-doped n+ InAs regrowth on the 10nm In0.53Ga0.47As channel is 9.9Ωμm (3.9Ωμm2) and 6.6Ωμm (2.3Ωμm2), and the contact resistance for the Si doped and Si and Te co-doped n+ In0.53Ga0.47As regrowth on the 7nm In0.53Ga0.47As channel is 8.5Ωμm (2.3Ωμm2) and 6.8Ωμm (1.9Ωμm2). The improvement in contact resistance comes from improvements in electron mobility consistent with Te improving material quality as a surfactant.
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