Abstract:In ultrasonic polishing (USP), when the gap between the polishing tool and workpiece is small enough, the suspension seeped into it can be considered as suspension thin film (STF). STF flow field provides a periodic oscillation condition for abrasive particles, which can improve abrasive particle cutting performance by changing its behavior. It is very effective for improving the polishing efficiency and surface quality of hard-to-machine materials. However, the interaction behavior of target material, STF flow field, and abrasive particle in USP has rarely been studied. In this paper, to fulfill a fundamental understanding of this field, the behavior of abrasive particles impacting monocrystalline silicon in STF flow field is investigated by experimental and simulation methods. At macro-level, through the study of ultrasonic amplitude, abrasive particle size, and polishing tool rotational speed in USP experiments, the positive role of STF flow field has been revealed, and the change characteristic of surface roughness is obtained. The computational fluid dynamics (CFD) simulation results show that strong transverse shear flow is formed in STF, which plays a major role in material removal. At micro-level, novel mathematical models of plastic deformation and brittleness removal and material removal mechanism of STF flow field are proposed. Comprehensive analysis of blunt and sharp abrasive particles impacting monocrystalline silicon is implemented through finite element method (FEM), which includes the effect of abrasive particle size on material removal rate (MRR), kinetic energy change of abrasive particle, force analysis of impact, the effect of impact angle, and polishing tool rotation on MRR. The final results show FEM simulation results are consistent with that of CFD simulation and experiments, which is of great significance to reveal the behavior principle of abrasive particles in STF and guide the actual production.

Study on Experiments of Nano-Abrasive Polishing in Hydrodynamic Suspension Liquid

Preliminary Study of Disc Hydrodynamic Polishing

Removal Mechanism of Hydrodynamic Suspension Ultra-smooth Machining for Hard-brittle Materials

Experimental Research on Hydrodynamic Suspension Polishing for Nano-scale Ultra-smooth Surface

Polishing Of Ultra Smooth Surface With Nanoparticle Colloid Jet

Research on the Hydrodynamic Electro-Chemical Mechanical Polishing for Silicon Wafer with Suspension Fluid

An Experimental Study of the Nanoparticle Colloid Hydrodynamic Cavitation Jet Polishing Performance under Different Nozzle Designs

Nano Particles’ Behavior in Chemical Mechanical Polishing With the Effect of Non-Newtonian Properties of Slurry

Nano-friction behavior and deformation study of hydroxyapatite in ultra-precision polishing process

Modeling and experiment on elastic material removal in nanoparticle jet polishing

Study on magnetorheological nano-polishing using low-frequency alternating magnetic field

Investigate on Material Removal of 3C-Sic Crystals in Nano-Polishing Via Molecular Dynamics

Experimental and simulation studies of abrasive particles impacting monocrystalline silicon in suspension thin film flow field of ultrasonic polishing

Cfd Modelling of A Novel Hydrodynamic Suspension Polishing Process for Ultra-Smooth Surface with Low Residual Stress

Variation of Surface Layer During Chemical Mechanical Polish

Modeling and experimenting of disc hydrodynamic polishing process for ultra-smooth surfaces

Novel Disc Hydrodynamic Polishing Process and Tool for High-Efficiency Polishing of Ultra-Smooth Surfaces

Surface integrity and material removal mechanism in fluid jet polishing of optical glass

Abrasive Jet Polishing Utilizing the Synergistic Effect of Ultrasonic Pulse-Cavitation and Process Optimization Research

Numerical Analysis of Solid-Liquid Two-Phase Abrasive Flow in Microcutting Polycrystalline Materials Based on Molecular Dynamics

Exploring the nano-polishing mechanisms of Invar