Electroless Copper Coating on Boron Carbide Particles by Using Copper Activation Method

Wei Wang,Qiu Lin Li,Wei Liu,You Wei Yao,Xue Jun Li
DOI: https://doi.org/10.4028/www.scientific.net/amm.576.127
2014-01-01
Applied Mechanics and Materials
Abstract:The present work is focused on electroless coating of copper nanolayer onto boron carbide (B4C) particle surfaces by using copper activation method. The B4C particles used are approximately 18.25μm in average size. B4C particle surfaces were washed by acetone and activated through copper activation method. In the electroless coating bath, copper sulfate, EDTA-2Na and seignette salt, hydrazine hydrate were used as the copper catalytic centers source, complexing agent and reducing agent respectively. The structure and morphology of the coating layers were characterized by X-ray diffraction (XRD) and scanning electron microscope (SEM). XRD and SEM observations show that B4C particle surfaces were successfully coated by a homogeneous and continuous copper layer.
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